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00600-656

http://seikausa.com/sites/default/files/product/mcdry/mcdry-smt-magazine.pdf

.) Weight-gain analysis (reference J-STD-020) establishes an estimated floor life, and weight-loss analysis estab- lishes the bake time required to remove excess component moisture . J-STD- 033 provides detailed information regard- ing bake temperature and time. IPC/JEDEC J-STD-033 provides rec- ommendations for handling, packing, ship- ping and baking moisture-sensitive com- ponents . IPC pre-bake recommendations prior to dry pack are: Package thickness less than or equal to 1.4 mm: For levels 2a through 5a, bake time ranges from 8 to 28 hours at 125 °C, or 4 to 14 hours at 150°C. Package thickness less than or equal to 2.0 mm: For levels 2a through 5a, bake time ranges from 23 to 48 hours at 125 °C, or 11 to 24 hours at 150°C. Package thickness less than or equal to 4.0 mm: For levels 2a through 5a, bake time is 48 hours at 125

http://www.cogiscan.com/documen.PDF

http://seikausa.com/sites/default/files/product/mcdry/cogiscan-apex.pdf

. As a result assemblers can insure that they only bake components when absolutely necessary and for the shortest possible duration while ensuring zero moisture-related defects . The latest revision of J-STD-033A was released in July 2002. Some of the most significant changes include the following : - New bake table with 90 different bake cycles . (ref: J-STD-033A, table 4-1) - There is no longer a limit to the number of bake cycles at 40C and 90C. The limit at 125C is now set at a cumulative duration of 48 hours to the double-side reflow consideration above, boards must be baked prior to localized hot air reflow in order to avoid moisture-induced defects. Since most populated boards include some components that cannot withstand the 125C bake cycle, it is generally recommended to use the 90C bake cycle, which can range between 11 hours to 10 days, based on the properties of the specific component that must be reworked. In this case, the automated system can be used to define the remaining floor life of each MSD once

Pressure curing vs Vacuum bake

http://www.hellerindustries.com/search.php?zoom_query=Pressure+curing+vs+Vacuum+bake&zoom_page=25&zoom_per_page=10&zoom_and=0&zoom_sort=2

Pressure curing vs Vacuum bake Reflow Soldering Dual Lane / Dual Temperature Curing & Back-end Semiconductor Voidless / Vacuum Fluxless / Formic Acid Soldering Pressure Curing Ovens (PCO Global Network Americas Asia Africa Australia & New Zealand Europe Inquiry » Search Heller Industries » Pressure curing vs Vacuum bake Pressure curing vs Vacuum bake Enter one or more keywords to search for. Note that '*' and '?' wildcards are supported. Match: any search words all search words Search results for: Pressure curing vs Vacuum bake No results found containing all search terms conveyor Water cooling GEM/SECs interface Industry 4.0 communication » Search Heller Industries » Pressure curing vs Vacuum bake Heller Industries, Inc

Pressure curing vs Vacuum bake

http://www.hellerindustries.com/search.php?zoom_query=Pressure+curing+vs+Vacuum+bake&zoom_page=25&zoom_per_page=10&zoom_and=0&zoom_sort=0

Pressure curing vs Vacuum bake Reflow Soldering Dual Lane / Dual Temperature Curing & Back-end Semiconductor Voidless / Vacuum Fluxless / Formic Acid Soldering Pressure Curing Ovens (PCO Global Network Americas Asia Africa Australia & New Zealand Europe Inquiry » Search Heller Industries » Pressure curing vs Vacuum bake Pressure curing vs Vacuum bake Enter one or more keywords to search for. Note that '*' and '?' wildcards are supported. Match: any search words all search words Search results for: Pressure curing vs Vacuum bake No results found containing all search terms conveyor Water cooling GEM/SECs interface Industry 4.0 communication » Search Heller Industries » Pressure curing vs Vacuum bake Heller Industries, Inc

Moisture Sensitive Devices (MSD) Council

https://www.smta.org/msd/msd.cfm

. The industry standards provide a set of guidelines that are notoriously difficult to understand and challenging to implement. Simplified manual procedures tend to err on the conservative side and result in a large number of unnecessary bake cycles . The bag seal date and the 12 months minimum shelf life is not an expiration date. The decision to bake components is strictly based on the status of the humidity indicator card when the bag is opened. 5 . The default bake cycles have been significantly increased from 24 hours to 48 hours at 125C, and from 8 days to 79 days at 40C. A table is provided in the IPC/JEDEC standard J-STD-033A to reduce the bake cycle according to the physical parameters of each component components during localized reflow. The default bake cycle for populated boards is 10 days at 90C. Upcoming Events February 28 2020 SMTA Chapter Officer's Leadership Forum Feb 28 - Mar 1, 2020 Orlando, FL March 10 Intermountain (Boise) Expo & Tech Forum March

ICEET Program

https://www.smta.org/iceet/2019_ICEET_Program.pdf

, Ph.D., David Bernard Consultancy To Bake or Not to Bake? Large Metallic BGAs in Sealed ESD Bags with no Indication of Humidity Exposure Bihari Patel, Microart Services Inc

Hnadout Quick Reference Matrix Side1 Marc.doc

http://www.hellerindustries.com.cn/docs/Hnadout%20Quick%20Reference%20Matrix%20Side1.pdf

—even on heavily loaded PCB’s. (Encourage a “Bake Off” vs. the competitors) • Low Mass Coil Heaters give instant response to load and profile changes for superior repeatability

The Greening of the Reflow Process

http://www.hellerindustries.com.cn/grnreflo.pdf

supplier’s potential to develop new, one-of-a-kind engineering concepts. Following the initial evaluation, four finalists were selected and a “bake-off

Wafer Dispense Pumps

http://www.gpd-global.com/co_website/fluiddispense-appsol-wafer.php

. Wafers without frames may be auto-aligned before presentation to the dispenser. Wafer handling systems may incorporate additional process features such as alignment, preheating, post-cure/bake, cooling, and second magazine

Wafer Dispense Pumps

https://www.gpd-global.com/co_website/fluiddispense-appsol-wafer.php

. Wafers without frames may be auto-aligned before presentation to the dispenser. Wafer handling systems may incorporate additional process features such as alignment, preheating, post-cure/bake, cooling, and second magazine

Unisoft - software CELLS next step builder

http://www.unisoft-cim.com/cells-next-step-builder.html

.   Examples are BAKE or SOLDER.   While        some actions are built-in, most are defined by the user.     -   The CONDITIONS table describes the outcomes of a step.   An examples is $PASS

Unisoft - software CELLS next step builder

https://www.unisoft-cim.com/cells-next-step-builder.html

.   Examples are BAKE or SOLDER.   While        some actions are built-in, most are defined by the user.     -   The CONDITIONS table describes the outcomes of a step.   An examples is $PASS

Wire hold down labels for PCB rework and assembly able to sithstand reflow temperatures 8mm round in

http://www.soldertools.net/hotdot-tm-s-8mm-round/

. This material combination has already been proven to stay in place during wave and reflow soldering processes and bake-out cycles as tens of thousands of rework stencils have been placed on boards using this material

Wire tacking labels for PCB rework and assembly able to sithstand reflow temperatures 10mm round in

http://www.soldertools.net/hotdot-tm-s-10mm-round/

. This material combination has already been proven to stay in place during wave and reflow soldering processes and bake-out cycles as tens of thousands of rework stencils have been placed on boards using this material

Robotic Hot Solder Dip Rework Service at BEST | Solder.net

https://www.solder.net/services/robotic-hot-solder-dip/

. Parts can be processed per GEIA-STD-0006. The typical robotic hot solder dip process consists of the following steps: De reel (if required) Pre inspection Bake

Metcal-Profiling-for-successful-BGACSP-Rework-White-Paper.pdf

https://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/Metcal-Profiling-for-successful-BGACSP-Rework-White-Paper.pdf

. Under x-ray inspection you would normally see solder shorts towards the centre of the device. Figure 3 shows the effect of “pop-corning” Fig 3 Blistered component substrate Solution to Problem The solution to this problem is to slowly pre-bake the components and boards prior to reworking them

Metcal-Profiling-for-successful-BGACSP-Rework-White-Paper.pdf

http://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/Metcal-Profiling-for-successful-BGACSP-Rework-White-Paper.pdf

. Under x-ray inspection you would normally see solder shorts towards the centre of the device. Figure 3 shows the effect of “pop-corning” Fig 3 Blistered component substrate Solution to Problem The solution to this problem is to slowly pre-bake the components and boards prior to reworking them

Used PCB Assembly equipment - general

http://ce-exchange.com/category/depanel-other-pcba.cfm

(1) Bake Oven (1) Cal Kit (1) Component Counter (2) Downdraft Table (1) Dry Box (1) Engraver (1) Feeder Calibration Jig (1) Fume Collector (1) Gravity Oven (1) N2 Dry Box (1) Off-cut remover (2) Parts Counter (3) Pneumatic Press (1) Press (1) Router (1 : 6157 Status: Available Read Details Thermotron Temperature Chamber Bake Oven Large cavity baking chamber in good condition CEE ID

Thermotron Temperature Chamber

http://ce-exchange.com/detail/thermotron-temperature-chamber-bake-oven-6108.cfm

-exchange.com Thermotron Temperature Chamber Bake Oven Thermotron Temperature Chamber {ID: 6108} Large cavity baking chamber in good condition CEE ID: 6108 Status: Available Model

How to make a good PCB solder ball

https://www.ourpcb.com/solder-ball.html

. You’ll most likely need to remake the board, as you can’t bake the trapped air away. If paste gasses are jetting off from underneath the board, you can resolve this by reducing the amount of paste

Meet the cleaning ingredient

https://www.clariant.com/pt/Corporate/Blog/2019-Blog-Posts/03/An-Interview-on-Aristocare-Smart

. The other halves were applied with the same cleaner but without the polymer additive. Once dry, soap scum was also applied and then heated to ‘bake

Meet the cleaning ingredient

https://www.clariant.com/en/Corporate/Blog/2019-Blog-Posts/03/An-Interview-on-Aristocare-Smart

. The other halves were applied with the same cleaner but without the polymer additive. Once dry, soap scum was also applied and then heated to ‘bake

Moisture Sensitive Devices (MSD) Council

http://smta.org/msd/msd.cfm

. The industry standards provide a set of guidelines that are notoriously difficult to understand and challenging to implement. Simplified manual procedures tend to err on the conservative side and result in a large number of unnecessary bake cycles . The bag seal date and the 12 months minimum shelf life is not an expiration date. The decision to bake components is strictly based on the status of the humidity indicator card when the bag is opened. 5 . The default bake cycles have been significantly increased from 24 hours to 48 hours at 125C, and from 8 days to 79 days at 40C. A table is provided in the IPC/JEDEC standard J-STD-033A to reduce the bake cycle according to the physical parameters of each component must be de-rated. 10. Boards must be baked prior to rework to avoid damaging moisture sensitive components during localized reflow. The default bake cycle for populated boards is 10 days at 90C. Upcoming Events April 25 SMTA China East Technology

Upcoming Expos

http://smta.org/expos/

. Special Kneads and Treats , a non-profit specialty bake shop, provides free birthday cakes to children in our community that cannot afford them while providing Special Needs adults in the same

Cure (Permanency) UV Initiated Dry Film Solder Mask

http://ipc.org/TM/2.3.23.1a.pdf

. b. Another specimen at manufacturer’s recommended U.V. level and bake cycle. These REFERENCE specimens become the standards from which the test method will measure cure differences

JEDEC and IPC Update Essential Component Assessment Standard, J-STD-020E | IPC

http://ipc.org/ContentPage.aspx?Pageid=JEDEC-and-IPC-Update-Essential-Component-Assessment-Standard-J-STD-020E

. Guidance on bake time is also provided in the case that bake test interruption is observed. The development of J-STD-020E was spearheaded by JEDEC's JC

http://www.zestron.com/fileadmin/Filestorage_US/zestron-news/ZESTRON_NEWS_-_Fall_2015-int.pdf

. MAIN RESEARCH The ZESTRON® Test Vehicle was used for all trials and populated with five (5) each chip cap components. Three (3) thermal cycle variations were employed for this study: • Single reflow • Dual reflow • Dual reflow + B (bake

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Fluid Dispense Pump Integration

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