Electronics Forum | Mon Jan 12 02:29:13 EST 2009 | sachu_70
Hi Milan, One cause for such BGA failures could either be a laminate warp (bow or twist) formed during your Reflow or Wave soldering process, or perhaps a warp seen on the BGA component package itself prior to processing on SMT line. IPC guidelines f
Electronics Forum | Wed Apr 08 11:05:53 EDT 2009 | boardhouse
Hi, Need a little more info, 1) this board is definitely delaminated 2) this board looks like a Std FR4 board with 63/37 Hot air finish with probably 140 tg. material. Was this reflowed under lead free temps? 3) Do you Pre-bake product 4) What
Electronics Forum | Fri Apr 02 12:41:12 EDT 2010 | CL
Nicolas, 4.1.2.1 and 4.1.2.2 mention the requirements for drying an MSD to resett the clock life. 4.1.2.2 states that once a component is dried, refer to 5.3 for safe storage. Under that specification is 5.3.3.2 DRY Cabinet at 5% RH- This states tha
Electronics Forum | Thu Mar 11 02:56:01 EST 2010 | grahamcooper22
Hi, blow holes / pin holes / holes in joints are usually a sign that there is excess moisture somewhere around the solder joint. Moisture can be in pcbs / components, so try drying them....a simple thing to do is pass a bare pcb throught your reflow
Electronics Forum | Wed Nov 17 11:51:24 EST 2010 | vetteboy86
We have a problem child part. Our company was in a pinch and ordered parts from a broker that had an old date code. The leads are very oxidized, and our reflow process is comprimised. To prove the concept, we cleaned the leads with Tarn X and an aci
Electronics Forum | Wed Dec 22 18:16:46 EST 2010 | padawanlinuxero
Hello ! I have a problem with one of high runner, our board comes in a seal package with dessicant cant really tell you how much RH% is inside the bag, but our board does not spend a lot of time in the shelf just some days or a couple of weeks max,
Electronics Forum | Fri Mar 09 04:10:18 EST 2012 | grahamcooper22
Hi, I've been supplying Totech dry cabinets in the Uk for 10 years and in that time I've realised the only places to find the correct MSL level is on the dry pack the devices are shipped in or by spending hours on the internet or speaking to the devi
Electronics Forum | Wed May 09 03:13:06 EDT 2012 | umar
I had send my coating board to the test lab for adhesion coating test. 3 times send, the result 3times fail. The coating chemical use is Humiseal 1B31. The process is clean the boards at washing process use the Vigon A200 saponifier mix with DI wate
Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef
Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as
Electronics Forum | Tue Aug 28 08:28:30 EDT 2012 | rgduval
We agree with all of the previous comments, and would add the following: Warpage is generally caused by excess moisture in the raw boards. Have you tried baking the boards prior to assembly? We had this issue on a simple 4-layer board, and found t
