Electronics Forum: bake (Page 26 of 128)

BGA baking

Electronics Forum | Wed Mar 23 10:16:47 EDT 2011 | blnorman

If these are moisture sensitive they are required to be shipped in a moisture barrier bag and labeled as moisture sensitive. Depending on which moisture sensitivity level (MSL) the components have, floor life can range from unlimited to a mandatory

Selective Soldering Issues

Electronics Forum | Fri Jun 29 08:39:57 EDT 2012 | grauen06

We have not tried baking the boards yet. We are first going to try a new flux. If the flux fails we may try baking.

baking out pcbs after reflow process

Electronics Forum | Wed Jul 11 22:48:54 EDT 2012 | joeion

It is correct to remove moisture in PCB by baking. But I think the time and temperature is too little. According to our experience, it should be more than 60min at 120 centigrade degrees.

baking out pcbs after reflow process

Electronics Forum | Thu Jul 12 02:15:53 EDT 2012 | thmeier

Check also the specs / recommendations of your PCB manufacturer. We bake boards 4h/120°C before reflow and after automated cleaning (it´s not FR4!) and also if we have to rework with the autometd rework- stations (massive IR underheating ,..). Regar

Baking oven be kept off with MSDs inside

Electronics Forum | Mon Sep 03 06:01:21 EDT 2012 | amitsindwani

Should a baking oven be allowed to be kept off with MSDs kept inside ? Will it attract moisture back after a certain time period ?

Baking oven be kept off with MSDs inside

Electronics Forum | Thu Sep 06 10:04:26 EDT 2012 | kahrpr

We keep our MSDs in a dry cabinet. We only bake if we suspect we have a moisture issue usually PCBs or large BGAs and then it goes back in the dry cabinet.

MSD Storage

Electronics Forum | Thu Oct 25 06:45:52 EDT 2012 | mccabekev

I have read through the IPC/JEDEC J-STED-033.1 standards regarding bake and storage of MSDs. The lowest bake in the standard is

Water in TH cap sleeves

Electronics Forum | Mon Dec 01 14:51:55 EST 2014 | jpal

We had the same problem too. Water would remain under the caps even after a bake out. We saw this numerous times when the caps were removed after the wash and bake. The only fix was to hand solder the large electrolytics.

Baking MSL components in vacuum.

Electronics Forum | Tue Jan 09 08:46:03 EST 2018 | pavel_murtishev

Hi, "Baker with controlled humidity 5%" is actually dry cabinet. Using of dry cabinets i.e. ambient temperature baking is preferred. Vacuum will always be better. If you are going to use vacuum chamber, that will be the best method in my opinion.

Electronic Assemblies Manufactuirng - Bake-out ramp rate

Electronics Forum | Tue Jan 30 14:24:55 EST 2018 | emeto

I used to bake parts before. After I discovered the drying cabinets, that is not a concern anymore. I strongly recommend you to get one of these and try it. It dries them out pretty quick and keeps very low humidity all the time. No heat applied.


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