Electronics Forum | Fri Jul 06 10:35:32 EDT 2012 | ashworth14
All i used to do was blow them with an airline to remove the excess moisture then bake them for 15/20 min at 100' in an oven and that seems to work fine, i did get the info from a 4 stage cleaning guide for the actual cleaning solution we used but it
Electronics Forum | Wed Sep 05 16:35:22 EDT 2012 | davef
It depends, but I'd guess that as a minimum the floor clock will start when the component returns to room temperature. It's easy to argue that the floor clock starts earlier than that!!! Probably, the floor clock starts a couple degrees lower than th
Electronics Forum | Tue Nov 06 12:43:31 EST 2012 | deanm
4.2.7.1 states, ...If the bake temperature is not greater than 90 °C, there is no practical limit on bake time... If I interpret that correctly, then you may keep MSDs in a 40 deg. C oven indefinitely with no adverse conditions. Instead of opting
Electronics Forum | Mon Feb 20 08:33:57 EST 2017 | philc
In your pictures, many of the pads that have lifted from the PCB look as though they have no conenctions anyway. We often find that pads that aren't connected lift very easily. One possible solution would be to bake the BGA's for 12 hours prior to f
Electronics Forum | Wed Apr 26 06:09:12 EDT 2017 | ajaytyagi
Hi, Pl let me know about opinion/experience whether thick film chip SMD resistor which is MSL-1 Required to bake before being usedon SMT line. I want to use SMD resistance spool which is around 2 yeasr old kept at 25 deg room temperature at around 4
Electronics Forum | Thu Sep 19 21:31:37 EDT 2019 | deanm
Briefly opening the door probably won’t affect anything significantly. If in doubt, add an extra hour to the bake time. A better approach might be to keep both parts in the oven for 25 hours. You have up to 96 hours before oxidation becomes an issue.
Electronics Forum | Mon May 17 13:21:45 EDT 2021 | SMTA-64387881
PWB Bake out or other elevated temperture processes can cause issues with oxidation of that Nickel layer. The gold porosity can vary from batch to batch, but also process changes can contribute. Are you baking the boards or have previous reflow pro
Electronics Forum | Wed Mar 02 13:15:16 EST 2022 | chris007
I am currently working on a manufacturing flow where some PCBA are processed with reflow oven (after being baked before processing), then cleaned with bath, then passed into contaminometer, passed into AOI. The point is after all of this, if AOI dete
Electronics Forum | Tue Oct 03 18:09:06 EDT 2023 | glasscake
Try a liquid latex masking material. Youll most likely have to cover the hole with kapton, really drench the thing in the liquid latex to prevent the ultrasonic from damaging it then bake it at 50-70c for about 2-4 hours. With no bake its usually a 2
Electronics Forum | Thu Jun 15 21:51:17 EDT 2000 | Dave F
Jeff: You're correct �7.1.3 of ANSI J-STD-001C states " Drying / Degreasing states the assembly may be treated to remove moisture and other volitiles." We don't bake "FR4" for love nor money. The archive are littered with threads along this line.
