Electronics Forum | Fri Jan 29 16:11:29 EST 1999 | Charles L. Morehouse
|I aggree with Sarah, I have found that Stanley sells a good configurable product for the money. | I've had good luck with cabinets sold by Stanley Storage Systems (800-523-2449). This is a sturdy, steel cabinet (no windows) that is intended for
Electronics Forum | Wed Oct 28 13:21:40 EST 1998 | Jim Gleason
Does anyone know where to get conductive coatings you can spray/paint/bake on hard surfaces? I would like tha actual manufacturer not a coating service company.
Electronics Forum | Wed Sep 30 12:11:56 EDT 1998 | Claudine Hanson
We are trying to eliminate/minimize the baking process for high lead-count ICs. We would like to reseal packages containing these parts to minimize exposure to humidity. Anyone have or know of a way to reseal or vacuum pack parts? Any suggested eq
Electronics Forum | Fri May 22 13:20:33 EDT 1998 | Earl Moon
| | | Does anyone know about low pressure/low temperature | | | ovens used for baking of moisture senstive | | | components? | | | Thanks | | I need to know from where your need came. I usually just bake in conventional ovens with specified times a
Electronics Forum | Fri May 15 10:06:28 EDT 1998 | Mike
| We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin packages. |
Electronics Forum | Fri May 15 10:27:16 EDT 1998 | Justin Medernach
| | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin package
Electronics Forum | Wed May 13 07:24:12 EDT 1998 | Sherry
Does the temp. profiles used to reflow double sided pcb's through a IR oven on FR4 board material have to be re-established if it is changed to polyimide? Boards will be baked out prior to assembly. any response would be most appreciated.
Electronics Forum | Thu May 14 04:11:33 EDT 1998 | JACK CHEN
| Does the temp. profiles used to reflow double sided pcb's through a IR oven | on FR4 board material have to be re-established if it is changed to | polyimide? Boards will be baked out prior to assembly. | any response would be most appreciated.
Electronics Forum | Mon May 04 10:50:11 EDT 1998 | Eric Jenkins
Looking to buy used or new tubes, that will fit an SOIC-16 Need these tubes ASAP. We need to bake these parts and drypack. Please email or call if you can help. Eric Jenkins 801 956-0897
Electronics Forum | Mon Aug 13 17:38:05 EDT 2001 | fmonette
Praveen, Once you find out the MS level of your components, you will need to track the exposure time from when the parts are initially removed from their dry bags, through test, programming, taping, and during subsequent dry storage and use of thes
