Electronics Forum | Wed Sep 17 08:51:10 EDT 2008 | 18424
We have seen this same defect. Led's not blinking during test and some tops popping off. Ended up being an msd problem. most of the lite-on components are msl level 4-6. We now bake and track them no problems seen in a while.
Electronics Forum | Fri Nov 21 09:29:11 EST 2008 | saintete1304
Hi , i desire to find the type of information : When the Soldering must be performed after baking for the PWB to not have a POP problem link to the moisture ? And the time for a flexible PWB ? thanks best regards
Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55
Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D
Electronics Forum | Mon Dec 08 18:25:35 EST 2008 | yuepingwu
Hi Bob, Do you have information about IPC D-35 for reference? What moisture sensitive level is the Sn-Pb/RoHS of PWB? Does PWB supplier start to implement PWB drying packaging?
Electronics Forum | Tue Jan 06 14:37:27 EST 2009 | stevek
The easiest way to prove out the absorbtion theory is to weigh the parts before wash, after wash, and after baking. You probably want to do this with the bare parts in isolation as the fab will pick up considerable moisture. Differences in weight s
Electronics Forum | Mon Jan 12 02:56:42 EST 2009 | sachu_70
Hi Bill, You should try pre-baking any such old devices prior to using on SMT Reflow. Refering to MSL-type3 guidelines could help in your case.
Electronics Forum | Tue Feb 03 11:33:08 EST 2009 | nath
Hello, Can anyone list out issues or concerns with assembly with PTFE based laminates. I am looking for any concerns related to handling, SMT reflow, Wave, Baking, rework, BGAs? ANy feedback is much appreciated. Thanks!
Electronics Forum | Tue Feb 03 16:23:40 EST 2009 | gnath
Hello, Can anyone list out issues or concerns with assembly with PTFE based laminates. I am looking for any concerns related to handling, SMT reflow, Wave, Baking, rework, BGAs? ANy feedback is much appreciated. Thanks!
Electronics Forum | Thu Apr 09 07:37:18 EDT 2009 | fowlerchang
Another suggestion for it. Baking the whole boards before rework the BGA. It is not only benifit to the BGA but also to the pad.
Electronics Forum | Wed Apr 08 09:09:39 EDT 2009 | tommyttr
That is a delamination. It is indeed from moisture. You need to bake the boards for at least 8 hours and you should be good to go.
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