bake

"bake" search results in the Electronics Forums



1228 results found for "bake" in the Electronics Forums

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Curious PCB technology

Jan 30, 2020 | Clever idea. I used to work on hybrids. baking temp about 850 degrees C we used titanium and ceramic

solder ball

Dec 30, 2019 |

Help required selecting reflow oven

Nov 13, 2019 | I suggest you buy 8 zone oven, its best for baking and you can easily control overflow of heat, I am

wire harness strength

May 18, 2017 | We are soldering wire 26AWG to jack socket. However after went through washing, baking, coating, cur

LGA Solder Balls

Mar 8, 2016 |

Regarding BGA Pad Lifting

Feb 10, 2016 |

ENIG PCB date code 2012

Jul 24, 2015 |

Water in TH cap sleeves

Nov 26, 2014 |

Flex Cable

Jan 21, 2014 |

Delamination effect in FR1 type PCB (Lead free soldering)

Jan 6, 2014 | Make sure you are providing an adequate moisture bake out prior to wave soldering. It sounds moistu

Conformal Coating Room

Jul 31, 2012 |

PCB Delamination

Jun 1, 2012 |

PCB Delamination

Aug 5, 2011 |

Flex Circuit Assembly Process (Sitiffeners)

Oct 1, 2010 | You don't necessarily have to bake the flex circuits, but you do have to worry about moisture. Poly

Silkscreen turns Purple

Sep 9, 2010 |

PCB Warp Issues

Jul 23, 2010 | I think that it can be solved by placing ths into a baking oven with the set point above the PCB Tg.

PCB Warp Issues

Jul 20, 2010 |

Wave Solder - solder bubbles/outgassing??

Nov 21, 2006 | Had exactly the same problem the other week. Baked some boards did improve slightly but not convinci

RoHS Board Delamination

Oct 24, 2006 | Mark, The pcb manufacturer recommended we bake the boards , so we did. I even weighed a batch bef

RoHS Board Delamination

Oct 24, 2006 |

Unknown

Sep 22, 2006 |

Clean the No-Clean

Feb 13, 2006 |

Boards getting

Aug 12, 2005 |

Unknown

Feb 26, 2005 |

Reflowing <.032

Feb 18, 2005 |

Coating adhesion problems

Sep 21, 2004 |

PCBA delam after reflow

Aug 27, 2004 |

Moisture sensitive IC rework requirement

Apr 27, 2004 | Hi CT, The bake requirements for Moisture Sensitive Components are defined in table 4-1 of the j

BGA PROCESS MATERIAL

Feb 20, 2004 |

QFP Removal

Feb 17, 2004 | Do you have a bake oven that will reach 200C? You could bring a batch of boards up to temp and then

Industry 4.0 Reflow Oven

best reflow oven