Electronics Forum: bake out (Page 1 of 39)

Alternatives to device bake out

Electronics Forum | Fri Feb 19 06:45:29 EST 1999 | Charles Stringer

Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. I have come accross dry nitrogen storage chambers

PWAs & PWB bake out requirements

Electronics Forum | Thu Aug 09 19:13:37 EDT 2007 | htran

DaveF, Our customer requirement is to comply with IPC-STD-001 but the J std doesn't specify the bake out temperature for populated boards and the moisture absortion rate. Right now we are baking the populated PWAs after aqueous wash at 80C at 18-48

Re: Alternatives to device bake out

Electronics Forum | Sat Oct 16 23:54:43 EDT 1999 | Stu Leech

We have just completed some scientific work on the subject of component bake-out and alternative methods of getting the job done quickly. If you would like a copy, email me at sleech@ix.netcom.com Stu Leech

PWAs & PWB bake out requirements

Electronics Forum | Wed Aug 08 17:26:40 EDT 2007 | htran

Hello All, I have been searching for the board assemblies bake out requirements acceptance criteria but unsuccessful. Does anyone knows if there are general guidelines for the percentage of the moisture absorption in the PWBs and PWAs? Thanks, Tran

Bare PWB bake out during circuit assembly

Electronics Forum | Fri Nov 05 14:47:35 EST 1999 | Russ Cutler

We recently came to a cross roads... We have historically baked out ALL of our circuit cards, with a 2 fold purpose 1) to dry the part marking ink, and 2) to eliminate any moisture, which could result in measling further in the process of assembly.

PWAs & PWBs bake out requirements

Electronics Forum | Fri Aug 10 16:22:35 EDT 2007 | htran

Davef, The J Standard-001-DS(Ref. 4.9.3)does required board assembly bake out and the purpose of the bake out is to demoisturize the PWB and to prevent board delamination during reflow like you have mentioned earlier. Thanks for your inputs. I hav

Re: Alternatives to device bake out

Electronics Forum | Mon Feb 22 13:15:43 EST 1999 | Dave F

Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. I have come accross dry nitrogen storage cham

PWAs & PWB bake out requirements

Electronics Forum | Fri Aug 10 07:33:32 EDT 2007 | davef

Tran Since we all agree that J-001 has no baking requirement, why are you baking the boards? What is the purpose of this bake process?

Re: Alternatives to device bake out

Electronics Forum | Mon Feb 22 12:20:51 EST 1999 | Dave F

Does anybody have any reliable alternatives to device bake out for plastic bodied components. We do not use a whole package at time and therefore have to oven bake the balance before we can use them. I have come accross dry nitrogen storage cham

PWAs & PWBs bake out requirements

Electronics Forum | Tue Aug 14 20:28:38 EDT 2007 | davef

Just talking off the top of my head, I'd guess that greater weights can be tolerated on the bottom side of two sided reflow when using lead free solder than leaded solder.

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