Electronics Forum | Tue Nov 30 02:46:21 EST 2010 | libandara
We want to handle the materials such as PCB & MSD components as per IPC 1601 & J-STD-033. As such, we need a baking oven to perform this and to monitor (temperature – we have to maintain up to 200’C & humidity – below 5%)the control environment & ma
Electronics Forum | Tue Mar 17 10:47:56 EDT 2020 | davef
IPC-1601 covers PWB bake-out, methods for determining optimum bake time and temperature, caveats for certain PWB plating finishes, etc. IPC-1601 is to bare boards as J-STD-033 is to components
Electronics Forum | Fri Oct 07 08:48:45 EDT 2016 | davef
Two things ... A friend in the contract coating business said: "... the board is not being baked out long enough, 30 min is certainly not long enough depending on how many layers this board is, as the vacuum (from the parylene process) is pulling t
Electronics Forum | Fri Apr 18 18:06:47 EDT 2014 | davef
Methods that can reduce the wettability of OSP: * Previous heat cycles * Previous cleaning cycles * IPC-1601 "Printed Board Handling and Storage Guidelines" says do not bake prior to soldering * Using improper handling methods BR ... davef
Electronics Forum | Fri Apr 23 17:59:54 EDT 2010 | hegemon
Therein lies the issue. Unknown storage conditions before we received the PCBs, date codes just expired (2 weeks), first article is de-lam city! Had a bad feeling about it. Have read some studies showing that there is no linear tie in of visual cha
Electronics Forum | Tue Dec 09 09:46:31 EST 2008 | lazzara55
SMT-ypw: Do you have information about IPC D-35 for reference? B3: The D-35 is a subcommittee responsible for developing industry guidelines on the proper handling, shipping and storage of printed boards and printed board assemblies. Moisture is a ma
Electronics Forum | Thu Dec 04 09:49:11 EST 2008 | lazzara55
Dear Steven: Often the recommendations for baking prior to assembly are derived from various J-stds. But J's currently concern baking moisture out of components, and fail to address the moisture issues of the PCB. Because of that, there is the IPC D
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