Electronics Forum: baking and 1601 (Page 1 of 6)

PCB & MSD Component baking oven

Electronics Forum | Tue Nov 30 02:46:21 EST 2010 | libandara

We want to handle the materials such as PCB & MSD components as per IPC 1601 & J-STD-033. As such, we need a baking oven to perform this and to monitor (temperature – we have to maintain up to 200’C & humidity – below 5%)the control environment & ma

OSP and getting full pad wetting??

Electronics Forum | Fri Apr 18 18:06:47 EDT 2014 | davef

Methods that can reduce the wettability of OSP: * Previous heat cycles * Previous cleaning cycles * IPC-1601 "Printed Board Handling and Storage Guidelines" says do not bake prior to soldering * Using improper handling methods BR ... davef

PCB BAKING

Electronics Forum | Tue Mar 17 10:47:56 EDT 2020 | davef

IPC-1601 covers PWB bake-out, methods for determining optimum bake time and temperature, caveats for certain PWB plating finishes, etc. IPC-1601 is to bare boards as J-STD-033 is to components

AOI, Quality and SPC

Electronics Forum | Wed Mar 05 03:43:58 EST 2003 | testing

Hi, Mike Thanks for the reply With your oracle system were you able to perfom SPC analysis? and if possible do you have any Material that may be helpful for me to get my system setup i.e. whether through Excel, Access, Oracle etc. + What are your

Blistering and delaminating boards

Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1

Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di

SPC and Wave

Electronics Forum | Fri Jul 15 13:28:55 EDT 2005 | Brian

A process consists of much more than just thee machine. When developing a cause and effect diagram ffor the process, there are many parameters that fall outside the machine itself. There are Man, Machine, Methods, and Materials. Just monitoring th

Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Jan 25 18:15:39 EST 1999 | Joe

Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and re-packed

seperation of soldermask and pcb

Electronics Forum | Tue Mar 25 09:35:28 EDT 2014 | emeto

Have you tried to bake the boards before you process them?

seperation of soldermask and pcb

Electronics Forum | Tue Mar 25 10:31:05 EDT 2014 | sara_pcb

The boards are baked for 2 hours at 120 deg C Regards, R.Saravanan

Soldering robot and solder balls

Electronics Forum | Wed Jun 21 19:01:48 EDT 2017 | mac5

Try baking the boards; you may have a moisture problem.

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