Electronics Forum: baking and before and comform (Page 1 of 3)

Wash and bake of blank PCB's before assembly

Electronics Forum | Thu Jun 04 14:30:13 EDT 1998 | Igmar

I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards before assembly. + Is it necessary to wash and bake PCB�s before assembly? + If any, what is the reason for wash and bake of PCB�s? + If any, what type of

Wash and bake of blank PCB's before assembly

Electronics Forum | Thu Feb 12 16:50:40 EST 1998 | Igmar

I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards before assembly. + Is it necessary to wash and bake PCB�s before assembly? + If any, what is the reason for wash and bake of PCB�s? + If any, what type of

Re: Wash and bake of blank PCB's before assembly

Electronics Forum | Thu Feb 12 17:21:07 EST 1998 | Justin Medernach

| I would appreciate any information concerning the wash and bake of blank Printed Circuit Boards | before assembly. | + Is it necessary to wash and bake PCB�s before assembly? | + If any, what is the reason for wash and bake of PCB�s? | + If any, wh

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 15:53:17 EDT 2005 | adrian_nishimoto

This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.

BGA rework: Coplanarity of Xilinx before and after reflow.

Electronics Forum | Mon May 16 15:29:53 EDT 2005 | jdumont

We have the exact same issue with out 456 ball Xilinx parts. The corner balls either do not touch or are so stretched out that they are intermittant. I believe this to be a moisture ingress problem. Ive been setting up our little batch oven this afte

SPC and Wave

Electronics Forum | Fri Jul 15 13:28:55 EDT 2005 | Brian

A process consists of much more than just thee machine. When developing a cause and effect diagram ffor the process, there are many parameters that fall outside the machine itself. There are Man, Machine, Methods, and Materials. Just monitoring th

seperation of soldermask and pcb

Electronics Forum | Tue Mar 25 09:35:28 EDT 2014 | emeto

Have you tried to bake the boards before you process them?

Water cleaning and Moisture Entrapment

Electronics Forum | Tue Jan 06 14:37:27 EST 2009 | stevek

The easiest way to prove out the absorbtion theory is to weigh the parts before wash, after wash, and after baking. You probably want to do this with the bare parts in isolation as the fab will pick up considerable moisture. Differences in weight s

Solderability of BGA and PCB

Electronics Forum | Mon Nov 20 04:04:42 EST 2000 | Gyver

Sirs, Please do me a favor to answer the following questions, thanks a million! 1. Will the baking of BGA or PCB cause more oxidation before the SMT process? 2. What is the acceptable Life Time of solderability at customer site? The time that the sol

Cracking Capacitors and Solder Balls

Electronics Forum | Mon Jun 08 14:19:30 EDT 1998 | Gary Simbulan

Earl, et al, Boy things get old and cold around here fast. I promised more detail on my capactior problem and I thought I could drop something completely different in the same message and tell a tale of solder balls. First the caps. We still have

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