Electronics Forum | Wed Mar 23 10:16:47 EDT 2011 | blnorman
If these are moisture sensitive they are required to be shipped in a moisture barrier bag and labeled as moisture sensitive. Depending on which moisture sensitivity level (MSL) the components have, floor life can range from unlimited to a mandatory
Electronics Forum | Fri Aug 24 12:20:41 EDT 2007 | petep
I have an MSL3 part (a relay) supplied in tape and reel. From what I am able to determine, these parts require baking at 257 degrees F for a minimum of 8 hours once the integrity of the seal is broken for over 168 hours. How are parts baked at th
Electronics Forum | Thu Aug 30 09:56:16 EDT 2007 | blnorman
According to J-STD-033 Table 4-1, the bake out time to restore the clock to zero is not only determined by the MSL level, but the package thickness as well. Section 4.2.2 states "SMD packages shipped in low temperature carriers may not be baked in t
Electronics Forum | Thu Jul 12 11:56:20 EDT 2012 | hegemon
You might try to complete all your soldering within a 72 hour or less time frame. For all intents treat your board like a moisture sensitive component after you have baked and completed SMT reflow. Wash, blow dry, and go direct to stuffing and com
Electronics Forum | Mon Jan 12 02:56:42 EST 2009 | sachu_70
Hi Bill, You should try pre-baking any such old devices prior to using on SMT Reflow. Refering to MSL-type3 guidelines could help in your case.
Electronics Forum | Wed Jan 03 01:51:23 EST 2018 | grek
Hello, i would like to ask if there is any differencies when baking components in baker with control huminidity 5% or when baking components in vacuum? is it ok ? or it should not be baked in vacuum? And one more question: Is it possible to bake tr
Electronics Forum | Tue Jan 09 08:46:03 EST 2018 | pavel_murtishev
Hi, "Baker with controlled humidity 5%" is actually dry cabinet. Using of dry cabinets i.e. ambient temperature baking is preferred. Vacuum will always be better. If you are going to use vacuum chamber, that will be the best method in my opinion.
Electronics Forum | Wed Mar 05 03:43:58 EST 2003 | testing
Hi, Mike Thanks for the reply With your oracle system were you able to perfom SPC analysis? and if possible do you have any Material that may be helpful for me to get my system setup i.e. whether through Excel, Access, Oracle etc. + What are your
Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1
Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di
Electronics Forum | Fri Jul 15 13:28:55 EDT 2005 | Brian
A process consists of much more than just thee machine. When developing a cause and effect diagram ffor the process, there are many parameters that fall outside the machine itself. There are Man, Machine, Methods, and Materials. Just monitoring th
