Electronics Forum: baking and vertical (Page 1 of 7)

Board Stacking and Conveying

Electronics Forum | Mon Mar 26 16:58:53 EDT 2018 | solderingpro

Is there anything stopping you from replacing the flat belt solution to a continuous running steel roller chain conveyor? - From there (depending upon board temperature) you should be able to buffer your boards in a vertical buffer station if neede

Vertical Oven Profiling and profiler

Electronics Forum | Tue Nov 29 06:31:51 EST 2016 | shockwave24

Hi all, I just would like to ask if what brand and model of profiler can you recommend for profiling of a Vertical Oven?

Pick and Place Rivet

Electronics Forum | Wed Aug 13 05:18:40 EDT 2008 | lococost

that's a pretty cool idea, I like some thinking 'outside the box '! 1. I don't think picking it up and placing it will be much of a problem. once the rivet is placed it will be held in place by the paste. However, you would need to make a tray that

AOI, Quality and SPC

Electronics Forum | Wed Mar 05 03:43:58 EST 2003 | testing

Hi, Mike Thanks for the reply With your oracle system were you able to perfom SPC analysis? and if possible do you have any Material that may be helpful for me to get my system setup i.e. whether through Excel, Access, Oracle etc. + What are your

Blistering and delaminating boards

Electronics Forum | Thu Sep 20 07:18:42 EDT 2018 | proceng1

Has anyone else been experiencing this lately? We have had a rash of boards that come in properly vacuum sealed. We store them in the hot room until we are ready to build, and we get bubbles under the solder mask. We've had 4 different jobs, all di

SPC and Wave

Electronics Forum | Fri Jul 15 13:28:55 EDT 2005 | Brian

A process consists of much more than just thee machine. When developing a cause and effect diagram ffor the process, there are many parameters that fall outside the machine itself. There are Man, Machine, Methods, and Materials. Just monitoring th

Moisture Sensitivity and Package Cracking

Electronics Forum | Mon Jan 25 18:15:39 EST 1999 | Joe

Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and re-packed

seperation of soldermask and pcb

Electronics Forum | Tue Mar 25 09:35:28 EDT 2014 | emeto

Have you tried to bake the boards before you process them?

seperation of soldermask and pcb

Electronics Forum | Tue Mar 25 10:31:05 EDT 2014 | sara_pcb

The boards are baked for 2 hours at 120 deg C Regards, R.Saravanan

Soldering robot and solder balls

Electronics Forum | Wed Jun 21 19:01:48 EDT 2017 | mac5

Try baking the boards; you may have a moisture problem.

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