Electronics Forum: baking table for bga components (Page 1 of 2)

PCB baking for rework

Electronics Forum | Tue Jul 16 00:53:39 EDT 2002 | kennyg

What is a typical time/temp baking cycle for an assembly prior to BGA rework? This bake is intended to prohibit PCB or nearby component damage as well as protect the component being removed for reball. A 24 hr bake at 125C would be great, but often

Mydata for prototyping?

Electronics Forum | Mon Jan 14 19:22:54 EST 2002 | wsanita

The great thing about Mydata is the ability to put small strips of components on the Y-table. Takes only a few minutes to setup. I build mainly protos and small lots. The y axis is the table. The head is the x. Any problems you may have heard of were

Baking time for PCBA rework

Electronics Forum | Sun Feb 03 08:44:25 EST 2002 | davef

There is no standard for baking an assembled board prior to BGA rework, nor should there be. The amount of time required to bake a board varies with: * Board material. * Board construction and layers. * Board size. * Components on the board. If som

Baking time for PCBA rework

Electronics Forum | Mon Feb 04 12:30:25 EST 2002 | fmonette

Dave highlighted all the elements that must be considered to determine the optimal temperature and duration for a pre-rework PCBA bake process. As far as the component is concerned, it really depends if you care about not damaging the package for r

Baking time for PCBA rework

Electronics Forum | Thu Apr 25 09:34:24 EDT 2002 | fmonette

Michael, By the way, the default bake duration should be 48 hours at 125C instead of 24 hours. The shorter duration was based on a standard that is now obsolete. The current revision of J-STD-033 includes a variable duration bake table, based on co

Baking time for PCBA rework

Electronics Forum | Thu Feb 07 09:07:10 EST 2002 | fmonette

Dason, Please be aware that weight gain is only a very crude estimate of the component moisture content. This is only accurate when the moisture is uniformly distributed inside the component (which is actually never). This measurement is usually no

IP3 placement for BGA / MicroBGA

Electronics Forum | Tue Mar 17 07:35:37 EDT 2009 | nagesh

We have the IC placer Fuji-IP3 machine.Can this machine be able to place MicroBGA / BGA with good vision system.My card has almost 8 BGA with 4 MicroBGA?Still now i had placed 1 or 2 BGA(Placement by body centering).In this machine the Y- table keeps

Re: Moisture Sensitivity and Package Cracking

Electronics Forum | Tue Feb 02 11:07:36 EST 1999 | justin.medernach@flextronics.com

| Greetings, | | We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? | What about those components which come on blister tape, should they get baked and r

Remove,Re-ball then Re-use BGA safely !!!

Electronics Forum | Wed Jul 03 11:37:36 EDT 2002 | fmonette

Dason, I apologize if some of the information sounds redundant but I don't think I explained my point very well (and the standard can get really confusing at times). I definitely agree with using C-SAM to look for internal defects. My only advise i

MSL Component - Popcorn Temp.

Electronics Forum | Wed Jul 04 09:58:50 EDT 2012 | daxman

Assuming that you have a saturated moisture-sensitive component: At what temperature would popcorning or internal component damage occur? I would guess that it would be at a temperature where water would boil, around 100 degrees? However, the JEDEC J

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