Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Mon Dec 31 09:00:06 EST 2001 | davef
Baking before assembly does nothing good. It: * Increases costs. * Adds steps to the process and makes scheduling more cumbersome. * Increases the amount corrosion on solderable surfaces. We used to bake to remove the moisture from boards that caus
Electronics Forum | Thu Aug 30 09:56:16 EDT 2007 | blnorman
According to J-STD-033 Table 4-1, the bake out time to restore the clock to zero is not only determined by the MSL level, but the package thickness as well. Section 4.2.2 states "SMD packages shipped in low temperature carriers may not be baked in t
Electronics Forum | Wed Jul 28 20:56:58 EDT 1999 | Dave F
| Currently, we are baking any PCB before process on SMT, the 'reason' is to dry any possible humidity that could be inner the PCB, it does not matter if the PCB is multilayer or not. We bake PCB's at 107C for 4 hrs and the board must be process into
Electronics Forum | Thu Apr 27 02:39:50 EDT 2017 | ajaytyagi
Thanks for sharing your experience. I have similar view too.
Electronics Forum | Wed Apr 26 06:09:12 EDT 2017 | ajaytyagi
Hi, Pl let me know about opinion/experience whether thick film chip SMD resistor which is MSL-1 Required to bake before being usedon SMT line. I want to use SMD resistance spool which is around 2 yeasr old kept at 25 deg room temperature at around 4
Electronics Forum | Fri Sep 20 17:45:50 EDT 2019 | deanm
It won’t hurt’em if under 96 hrs.
Electronics Forum | Fri Sep 20 17:47:49 EDT 2019 | qanalyst1
Very good. Thanks.
Electronics Forum | Tue Aug 14 15:45:06 EDT 2001 | davef
BOARD BAKING SCHEDULE: Bake time depends on the board thickness and construction. For laminated FR4 PCB, we bake between 6 and 24 hours at 100�C. ROOT CAUSE OF THE PROBLEM: Heating moisture entrapped between the laminations of the board too quickl
Electronics Forum | Fri Feb 01 16:14:55 EST 2008 | bghusker
We bake components in reels quite often using a low temp oven. If you look under JDEC standards they provide temps and baking times based off of the thickness of the part. The only problem with the low temp is that you could be looking at baking ti
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