Electronics Forum | Mon Sep 21 18:37:10 EDT 2009 | sbayeta
Hi, Our SMT line has placement capacity of 80K cph, but only 21K cph gluing capacity. The rate between reflow and glue of our products is around 5 to 1. The line works great for the reflow boards, but when we produce glue boards the glue dispenser
Electronics Forum | Tue Jun 29 14:55:22 EDT 2010 | rgduval
For the capacitors that Yageo analyzed... Were they taken out at representative points in the process?? ie. were samples taken from pre-assembly, pre-ICT, post-conformal coat, post-final test? You note that the parts 'seem' to be ok up to ICT. And
Electronics Forum | Fri Jul 16 17:39:33 EDT 2010 | deanm
It is a PCB design issue where the copper patterns are not balanced among the layers. Baking the boards in order to correct the warpage will not improve it. We've had a problem with one bare board in particular warping the same way from two differen
Electronics Forum | Fri Jan 18 15:22:29 EST 2013 | davef
You're trying to balance the 'cost' of changing the alloy in your solder pot with risk of running a continually unknown and constantly changing alloy. I can't tell you what's best, because that depend on your situation. Some thoughts on changing the
Electronics Forum | Wed Feb 13 09:04:33 EST 2013 | rgduval
Thanks, Dave. One thing that's beginning to concern me about the tankless heaters is their capabilities to get the water to the right temperature, at the right flow rate. It would be too easy to know the actual flow rate of the wash machine I bou
Electronics Forum | Thu Feb 13 03:49:15 EST 2014 | jlawson
Yes all above is correct, as solder deposits get smaller and mesh T4+ , actual metal to air contact surface area increases , say in contrast to T3, add to this less flux , and flux running away from the joint, re-oxidation and what flux is left, can
Electronics Forum | Mon Oct 13 09:22:14 EDT 2014 | rgduval
Deni, Thanks. I managed to do pretty much exactly that. I was able to get the changers to pop up, and check the vacuum on the nozzles. The first two nozzles are very well sealed into the changer (can't move them), but, the balance of the nozzles
Electronics Forum | Mon Jul 18 12:24:53 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Mon Jul 18 12:25:30 EDT 2016 | oleksz
Some people involved in PCB assembly process claim that SMD components reflow soldering problems are often caused by traces running under a component. According to this claim, trace (or any copper) covered by solder mask and placed under SMD componen
Electronics Forum | Tue Nov 20 11:19:07 EST 2018 | spoiltforchoice
Ahh but you're missing the key points. The YSM40 is in no way ever intended to operate on its own, to keep those 4 heads busy they all need to be placing high volume parts, combined with a high throughput of PCB's probably in dual lane mode which in
