Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Tue Jan 31 12:53:50 EST 2006 | Chunks
We just did this and are awaiting the results. Solder balling and a burnt looking flux where visual indicators that we noticed running regular paste at no-lead temps.
Electronics Forum | Tue Jan 31 14:23:39 EST 2006 | samir
Chunks, For our lead-free eval, we had the same problem with "charred looking" solder paste up the component termination of one of the smaller discretes, coupled with excessive solder balling...this smaller part did see peak temps in the 240 range -
Electronics Forum | Fri Feb 03 16:40:24 EST 2006 | Mike
At my last employer, we ran a number of tests to make a "Hybrid" profile work (same profile Joe lists) . It worked great for everything but BGAs. The problem (6 months ago) was using parts not rated for lead free reflow temps. As the market fills wit
Electronics Forum | Thu May 13 09:52:34 EDT 2021 | winston_one
Want to update this question a little, I know it appears few years ago, but I hope there is some updates... We have to assembly few samples of motherboards with this kind of finish (customer mistake during pcb order). Normally we can use leaded sold
Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga
| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro
Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Mon Dec 11 20:44:37 EST 2006 | davef
Title : LEAD-FREE WAVE SOLDER FLUX EVALUATION Author : Michael Havener Author Company : Benchmark Electronics, Inc Date : 09/25/2005 Conference : SMTA International Abstract : The European Union�s deadline to ban lead in electronic pr
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