Electronics Forum: balling (Page 1 of 291)

solder balling

Electronics Forum | Sat Aug 05 12:12:05 EDT 2000 | Ramon I Garcia C

Hello Friends: I'm new in SMT process, I have a problem with little balls of solder beside of the component, I'm tried reducing the apertures in the stencil and making home base, some times the balls desappear, but some time not, and some times

Solder balling under passives

Electronics Forum | Mon Sep 19 01:57:28 EDT 2016 | shriram

Hi guys, Problem: Mid chip solder balling. Component affected: 0603 caps only Defect is PCB specific (Meaning only one PCB is affected as the aperture is standard for that component). As a containment I'll give a home plate design for the compo

Solder balling under passives

Electronics Forum | Mon Sep 19 09:31:28 EDT 2016 | emeto

Whatever the cause is, will be fixed by applying less paste. So Homeplate it is.

Re: Micro solder balling

Electronics Forum | Fri Oct 27 08:59:17 EDT 2000 | Wolfgang Busko

Antonio: A lot has been said on this topic before. You might try the archives with "solder balling" and than check your process step by step ( you will find enough ) to find the cause of your problem. Any other advice would be repeating and repeating

Solder balling under passives

Electronics Forum | Mon Sep 19 09:16:24 EDT 2016 | markhoch

Hi Shriram, Are you saying that there is a trace running between the pads for this 0603 capacitor? If so, this design may be causing a gasketing issue between the stencil and the PCB. The uneven height prevents the stencil from sitting flat on the PC

Micro solder balling

Electronics Forum | Thu Oct 26 08:59:56 EDT 2000 | Antonio A. Medina

Ok guys, I need help. Here's the deal. We're getting micro solder balls under discreets on the bottomside of the board. Here's my set up... MPM screener w/vacuum plate 6 mil metal screen with 90% circular (rounded) apertures 7 mil (measured) past

Re: solder balling

Electronics Forum | Wed Aug 09 04:09:04 EDT 2000 | Jarno Py�ri�

Hello. I think, good stencil apertures is 80% from pad. And stencil thickness is 0.15mm - 0.20mm. I use 0.15mm thick stencil almost every pcb. Sorry my very bad english but i too learning. :)

Re: solder balling

Electronics Forum | Wed Aug 09 04:16:25 EDT 2000 | Jarno Py�ri�

And little more... If you use chip components, then that 80% from pads is good stencils apertures size. But if you use fine pitch components, example QFP, then you can use apertures, 90% from pads. I hoping that you understand something abou

Re balling BGA

Electronics Forum | Fri May 22 16:14:45 EDT 1998 | Earl Moon

I know it's been covered before, but is there a newest, best way to reball BGA devices. Also, what's the latest rework methodology (pardon my linguistics). Earl Moon

Re: Re balling BGA

Electronics Forum | Sun May 31 16:00:33 EDT 1998 | Eric

Earl, I am not sure of your specifc application but we have a good system to easily reball your BGA's E-mail me at bgakit@concentric.net for more information. Thanks, Eric

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