Electronics Forum | Wed Mar 31 09:44:12 EDT 2010 | bandjwet
One thing I would suggest right off the top is to go to a paste printing process. This will get first pass yields higher (usually 10+% higher than gel flux). If you are suggesting that you have good collapse everywhere, the profile is adequate (soun
Electronics Forum | Mon Oct 03 11:33:09 EDT 2011 | artposada
I have been getting solder balls on the leads of a transformer that I am soldering to my pc board. My parameters are listed below. The board PTH's are .039 The transformer leads are .0255 square. My solder pot temp. is 310C Solder is Lead Free AIM
Electronics Forum | Thu Jun 28 17:05:46 EDT 2012 | davef
Here’s what we seem to know: * There’s a problem with voiding in the solder connections of SMT capacitors * A void is an open area caused by air or process fluid that is trapped within a solder connection * Voids are an allowable condition as long as
Electronics Forum | Thu Oct 25 13:35:47 EDT 2012 | davef
Here's a paper that may help http://www.ipcoutlook.org/pdf/assembly_challenges_bottom_terminated_ipc.pdf Temperature Impact * Profile didn’t have a significant impact on voiding. * Voids slightly increased with higher temperature. Reflow Atmosp
Electronics Forum | Fri Apr 05 18:22:18 EDT 2013 | Adam
We have two ZipaTec 460s Selective Solder Machines, one for Lead and one for Lead-Free. This morning we noticed the solder pot was covered in solder balls, and after asking the operator what they had run, the answer was "Nothing." The operator had al
Electronics Forum | Mon Apr 29 14:36:26 EDT 2013 | bandjwet
I am trying to determine who out there is reballing devices below 0.4mm in pitch. We have been reballing as small as a 4-balled 0.15mm 4 mil ball diameter area array devices using an adhesive-backed reballing preform. 1. For such small devices we h
Electronics Forum | Wed May 28 19:21:09 EDT 2014 | hegemon
Just from the look of things (a picture) I would first guess it is a contamination problem on the PWB. Check over all your handling practices. Make sure the PWBs are NEVER touched by bare hands. I would not rule out the Black Pad phenomena, but i
Electronics Forum | Sun Sep 07 13:33:50 EDT 2014 | horchak
Edri PCBA design and pad geometry is one of the critical factors for BGAs. Typically the pad size for collapsible balls is 80% of the ball diameter. Pad size consistency is critical. In your situation what will happen the larger pads will wick the s
Electronics Forum | Thu Nov 13 10:05:18 EST 2014 | grimus
Hello, I'm fighting with problems of random solder balls that appears after reflow soldering around Pin in Paste component. I'm mounting this component with Pick and Place machine. I'm using solder paste type-3 and this is lead free product. This is
Electronics Forum | Sat Nov 15 05:08:45 EST 2014 | grimus
Same side (component side) if You give me e-mail I can provide You more pictures. I'm making one stroke with same speed (I'm using closed proflow head and DEK printer). 5 mils thickness stencil. Products requirement - 3 IPC Class (75 % and more fill
