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Solder Balls – Precision PCB Services, Inc.

https://precision-pcb-services-inc.com/collections/solder-balls

Solder Balls – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc . Home Catalog Blog About us Home › Solder Balls Solder Balls Browse by All BGA Balls BGA Reballing Lead Free REballing ROHS Solder Balls Sort by Featured Best Selling Alphabetically, A-Z Alphabetically, Z-A Price, low to high Price , high to low Date, new to old Date, old to new High Quality Lead and Lead Free Solder Balls for BGA Reballing. Lead Free .60mm Solder Balls Inventory Liquidation Sale $50.00 Lead Free Solder Balls .45mm Inventory Liquidation Sale $50.00 Lead Free Solder Balls .50mm Inventory Liquidation Sale $50.00 Solder Balls - Lead Free .20mm $75.00 Solder Balls - Lead Free .25mm $75.00 Solder Balls - Lead Free .30mm $75.00 Solder Balls - Lead Free .35mm $75.00 Solder Balls - Lead Free .40mm

Solder Balls - Lead Free .20mm – Precision PCB Services, Inc.

https://precision-pcb-services-inc.com/collections/solder-balls/products/solder-balls-lead-free-20mm

Solder Balls - Lead Free .20mm – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc . Home Catalog Blog About us Home › Solder Balls › Solder Balls - Lead Free .20mm Solder Balls - Lead Free .20mm $75.00 Default Title - $75.00 USD Quantity Add to Cart .20mm Lead Free Solder Balls (ROHS), SAC 305 250K Balls per Jar. For reballing BGA Chip. All sizes available in both Lead and Lead Free Ships within 24 hours .60mm Solder Balls Inventory Liquidation Sale $50.00 Lead Free Solder Balls .45mm Inventory Liquidation Sale $50.00 Lead Free Solder Balls .50mm Inventory Liquidation Sale $50.00 Solder Balls - Lead Free .25mm $75.00 Latest News Our August Newsletter is out! Read it at this link

How to make a good PCB solder ball

https://www.ourpcb.com/solder-ball.html

. Their placement is usually secured through a tacky flux. However, solder balls are a double-edged sword. Solder balls are also the most common defect that detracts from SMT assembly processes . The errors that can cause a solder ball to bring about defects in an assembled PCB are innumerable. According to IPC, solder balls do not cause defects so long as they’re held firmly in place. This article examines the good, the bad and the ugly of solder balls. What is a Solder Ball? Solder Ball Valve How to Make a Solder Ball ? What Causes Solder Balls During Hand Soldering? The Solder Ball Joint Reliability Problems and Defects Conclusion 1、What is a Solder Ball ? Solder balls are also called a solder bump or solder sphere, due to their geometry. A solder ball is a spherical piece of soldering used to connect chip packages to PCB

Wave Soldering-The Ultimate Guide To Effective Soldering

https://www.ourpcb.com/wave-soldering.html

soldering, you can encounter the following problems: 1. Copper pad dissolution: High temperature can dissolve the copper pad into the molten solder. 2. Solder balling: Solder balls can be formed due to the sticking of solder mask at high temperature. 3

US Webstore Product Detail | okinternational.com

https://www.okinternational.com/us-web-store/english/globalnavigation/us-webstore-product-detail?productId=47face6f-f641-432f-b321-bc20f2bc936d

4x4x0.75 mm body,16LD, 0.5 mm pitch  5 x LLP, plastic, Quad 5x4x0.75 mm body 24LD, 0.5 mm pitch  5 x LLP, plastic, Quad 7x7x0.75 mm body 44LD, 0.5 mm pitch  4 x PBGA 27 mm 256 balls , 1.27 mm pitch  3 x PBGA 17 mm 256 balls, 1.0 mm pitch  1 x PBGA 35 mm 388 balls, 1.27 mm pitch  1 x POP Bottom 305 balls 12 mm, 0.5 mm pitch  1 x Top of POP 128 balls 12 mm , 0.65 mm pitch  4 x CVBGA (thin BGA) 97 balls 5 mm, 0.4 mm pitch  4 x LGA/MLF100 pin 12 mm fine pitch, 0.4 mm pitch  4 x PLCC 44 pin 16 mm, 1.27 mm pitch

EMS_Metcal.qxp

https://www.okinternational.com/File%20Library/Metcal/Resources/White%20Papers/EMS_Metcal.pdf

. Solder Ball Kits The kit is based on the use of solder balls that can be dispensed into flux with special tools capable of picking up a single solder ball and placing it on a pad next to a compo- nent to be mounted . Components are precisely placed under microscopic view and the use of solder balls enables a high degree of control and repeatability. Once components and solder balls have been properly placed, hot air is applied to reflow the solder to the component part to be mounted ; the gel flux maintains the component and solder balls in place until the reflow process. A hot air tool with low airflow rate, such as the model HCT2-120 Hot Air Pencil from Metcal, is recommended for this reflow process to ELECTRONIC MFG. SERVICES (EMS ) The model HCT2-120 Hot Air Pencil is suitable for reworking small chip components using solder balls. minimize the deleterious effects of ther- mal shock on the PCB . Each Solder Ball Placement Kit includes the tools required for placing individual solder balls where needed. The kit also contains four different sizes of solder balls, 2000 of each, for use with four different component sizes

E112721-solder-ball-feeder_uk.pdf

https://www.europlacer.com/zh/special-feeders/?attachment_id=1468&download_file=5b88037ea3932

. By using exclusively licensed patent-protected techniques, the innovative feeders enable reliable assembly of solder balls as part of the standard surface mount pick-and-place process . This opens new possibilities in terms of design, including higher density, lower cost, smaller electronic modules and more. B E N E F I T S • High-yield automatic assembly of solder balls for BGA’s, solder balls are today being increasingly used in other areas within electronic assemblies. Many of the latest product designs for mobile phones, bluetooth, Wi-fi , PDA’s, laptops and other products are incorporating solder balls, usually as an attachment method for devices such as multi-component modules, daughter boards, shields, memory-stacks, special components and other parts

E112721-solder-ball-feeder_uk.pdf

https://www.europlacer.com/es/special-feeders/?attachment_id=1468&download_file=5b88037ea3932

. By using exclusively licensed patent-protected techniques, the innovative feeders enable reliable assembly of solder balls as part of the standard surface mount pick-and-place process . This opens new possibilities in terms of design, including higher density, lower cost, smaller electronic modules and more. B E N E F I T S • High-yield automatic assembly of solder balls for BGA’s, solder balls are today being increasingly used in other areas within electronic assemblies. Many of the latest product designs for mobile phones, bluetooth, Wi-fi , PDA’s, laptops and other products are incorporating solder balls, usually as an attachment method for devices such as multi-component modules, daughter boards, shields, memory-stacks, special components and other parts

Cybersolv C8882 | Kyzen: Eco-Friendly Cleaning Products, Industrial Cleaning Solutions

https://www.kyzen.com/products/cybersolv-c8882/

(conventional and plastic pump), mis-printed PCBs, wave soldering pallets and tools, fixtures and squeegees. Cybersolv C8882 dissolves the flux vehicle, which allows solder balls to release from the stencil during the stencil printer wipe sequence % concentration at ambient temperatures. Cybersolv C8882 wets and rapidly dissolves the flux that holds the solder spheres into a paste. Upon dissolution of the flux, solder balls release from the apertures and drop to the bottom of the cleaning tank . In well-designed stencil cleaning equipment, the solder balls are caught in recirculation filters, greatly extending bath life. Cybersolv C8882 has no ozone depleting or global warming potential and is non-hazardous

Aquanox A8820 | Kyzen: Eco-Friendly Cleaning Products, Industrial Cleaning Solutions

https://www.kyzen.com/products/aquanox-a8820/

™) built into Aquanox A8820 wets and rapidly dissolves the flux that holds the solder spheres into a paste. Upon dissolution of the flux, solder balls release from the apertures and drop to the bottom of the cleaning tank . In well-designed stencil cleaning equipment, the solder balls are caught in recirculation filters, greatly extending bath life. Aquanox A8820 is RoHS compliant and meets all REACH requirements to date

Sawa Ultrasonic Stencil Cleaners | Seika Machinery, Inc

http://seikausa.com/sawa

. Normal cloth wipe cleaning of stencils cannot completely remove solder paste especially in fine pitch applications as a small amount of solder balls have a tendency to adhere in the corners of the apertures   completely remove solder paste.  Solder balls have a tendency to adhere to the corners of apertures. Cleaning by Sawa Stencil Cleaner Product Line SC-5000GUS Table Top Unit SC-5000GUS w/ Stainless Steel Cart SC-500HE Hand Held SC-139GAE SC-145GAE ML736 Economy Fully Automatic Cleaner Sawa Overview

SC-5000GUS | Sawa Ultrasonic Stencil Cleaners | Seika Machinery, Inc

http://seikausa.com/sawa/sc-5000gus

. The Sawa 5000GUS removes solder balls from stencil apertures after normal wipe cleaning. A powerful hand held ultrasonic cleaning head (W4.61xD4.61xH3.94 in). The foam is utilized to capture solder balls dislodged by the cleaning head. Specifications Note: The specifications are subject to minor change for improvement of the product. Generator: W10.04 x D14.17 x

2D AOI Vision Inspection Technology and Applications at Saki America

https://www.sakiglobal.com/automated-optical-inspection-aoi-2d-technology.html

for not only SMT solder joints, but for all solder joints in mixed technology applications. Saki's FUJIYAMA algorithm enables solder inspection after wave soldering to check for extra components, dropped components, stray components, and solder balls. ECD (Extra Component Detection) Saki's ECD (Extra Component Detection) algorithm inspects for stray components, solder balls, and foreign materials across the entire surface of the circuit board and can detect objects of 300 microns or less, thereby eliminating these defects parts, excessive or foreign material, solder balls, or damage to the substrate. Images can be quickly and easily compared to a reference board, and reference board images can be easily updated for any changes to the board

SAKI Corporation

https://www.sakiglobal.com/article-xray-enables-full-inspection-inline-volume-production.html

. 3D computed tomography (CT) X-ray inspection, in particular, has been successful in detecting voids and head-in-pillow (HiP) defects in solder balls, which have caused concern in the industry ) that can occur anywhere. Figure 6 – Void in Solder balls Figure 7 – HiP in solder ball Figure 8 – Through-holes in solder Head-in-pillow defects (Fig 7 ) occurring in solder balls are the most difficult inspection items to find because they have varied defect shapes. However, Saki's 3D x-ray machine's high inspection capability, unique algorithm, and high definition 3D images identify almost all head-in-pillow defects

Products – Precision PCB Services, Inc.

https://precision-pcb-services-inc.myshopify.com/collections/all

. Home Catalog Blog About us Home › Products Products Browse by All Actuator BGA Balls BGA Nozzle BGA Ovens BGA Pad Repair BGA Reballing BGA Reballing Services BGA Rework BGA Rework Machine BGA Rework Nozzle BGA Rework Services BGA Solder Balls Solder Bumping Solder Certification Solder Sphere Solder Training soldering SP-360C SRT SRT 1000 SRT 1000 SRT 1000 BGA Rework Station SRT 1100 SRT 1100 HR SRt Calibration SRT Maintenance SRT $6,000.00 Solder Balls - Lead Free .20mm $75.00 Solder Balls - Lead Free .25mm $75.00 Solder Balls - Lead Free .30mm $75.00 Solder Balls - Lead Free .35mm $75.00 Solder Balls - Lead Free .40mm $75.00 Solder Balls - Lead Free .45mm $75.00 Solder Balls - Lead Free .50mm $75.00 Solder Balls - Lead Free .55mm $75.00 Solder Balls - Lead Free .60mm $75.00 Solder Balls - Lead Free .60mm $75.00 Solder Balls - Lead Free .76mm $75.00 SRT Training, Calibration and Certification

Solder Balls - Lead Free .20mm – Precision PCB Services, Inc.

https://precision-pcb-services-inc.myshopify.com/products/solder-balls-lead-free-20mm

Solder Balls - Lead Free .20mm – Precision PCB Services, Inc. Search Log in or Create account Cart : 0 Menu Cart 0 Home Catalog Blog About us Log in Create account Search Precision PCB Services, Inc . Home Catalog Blog About us Home › Solder Balls - Lead Free .20mm Solder Balls - Lead Free .20mm $75.00 Default Title - $75.00 USD Quantity Add to Cart .20mm Lead Free Solder Balls (ROHS), SAC 305 250K Balls per Jar. For reballing BGA Chip. All sizes available in both Lead and Lead Free Ships within 24 hours . Share 0 Share on Facebook Tweet Tweet on Twitter Pin it 0 Pin on Pinterest Fancy Add to Fancy +1 +1 on Google Plus More from this collection Solder Balls - Lead Free .25mm $75.00 Solder Balls - Lead Free .30mm $75.00 Solder Balls - Lead Free .35mm $75.00 Solder Balls - Lead Free .40mm $75.00 Latest News Another Shuttle Star SV560A SOLD

Pan Pacific Microelectronics Symposium

https://www.smta.org/panpac/special_events.cfm

. Bring your own clubs or rent them at the pro shop for $55. Two sleeves of balls are included in the rental price. Cost: $180.00 per person, per round

Ohio Valley Chapter

https://www.smta.org/chapters/chapters_detail.cfm?chapter_id=29

“FREE” for SMTA Members and Sponsors.  Included are green fees, golf cart, practice range, sleeve of golf balls, Continental Breakfast, lunch at the turn and a Prime Rib dinner . Included are green fees, golf cart, practice range, sleeve of golf balls, Continental Breakfast, lunch at the turn and a Prime Rib dinner

Press Releases

http://mirtecusa.com/news-pressreleases-gtaaward2013.php

. Automated Optical Inspection is required at two different stages within the LED packaging process. In the first stage the bond wire, chip die and stitch balls are inspected for defects prior to encapsulation

Welcome

http://mirtecusa.com/company-awards-2014gta.php

. Automated Optical Inspection is required at two different stages within the LED packaging process. In the first stage LED; wire bonds, chip die and stitch balls are inspected for defects prior to encapsulation

http://islandsmt.com/wp-content/uploads/2017/11/Brochure-for-SpectorBOX.pdf

— accurate defect decision by the software algorithms — Detect all visual defects of THT solder joints and easily detect bridges and solder balls Angular Camera’s Z-Axis FDLz NO YES FDAz YES YES The Mek SpectorBOX bottom up modular AOI is optimized for the inspection of THT solder joints and detection of solder bridges and solder balls : 1 top and 8 side cameras. The bottom up SpectorBOX is configurable with one of two different optical units: FDLz and FDAz. 1. Bottom Up Features: Powerful algorithms for solder bridge detection Dedicated algorithms for solder balls detection Histogram Analysis algorithms Condition based decision ") Characteristics Product type Automatic Optical Inspector Camera movement X+Y Direction PCB movement Stationary Parts inspection Soldering, Bridges, Solder Balls Imaging principle Synthetic Imaging, Spectral Analysis, Greyscale limits Imaging parameters Brightness, Hue ") Characteristics Product type Automatic Optical Inspector Camera movement X+Y Direction PCB movement Stationary Parts inspection Soldering, Bridges, Solder Balls Imaging principle Synthetic Imaging, Spectral Analysis, Greyscale limits Imaging parameters Brightness, Hue

https://islandsmt.com/wp-content/uploads/2017/11/Brochure-for-SpectorBOX.pdf

— accurate defect decision by the software algorithms — Detect all visual defects of THT solder joints and easily detect bridges and solder balls Angular Camera’s Z-Axis FDLz NO YES FDAz YES YES The Mek SpectorBOX bottom up modular AOI is optimized for the inspection of THT solder joints and detection of solder bridges and solder balls : 1 top and 8 side cameras. The bottom up SpectorBOX is configurable with one of two different optical units: FDLz and FDAz. 1. Bottom Up Features: Powerful algorithms for solder bridge detection Dedicated algorithms for solder balls detection Histogram Analysis algorithms Condition based decision ") Characteristics Product type Automatic Optical Inspector Camera movement X+Y Direction PCB movement Stationary Parts inspection Soldering, Bridges, Solder Balls Imaging principle Synthetic Imaging, Spectral Analysis, Greyscale limits Imaging parameters Brightness, Hue ") Characteristics Product type Automatic Optical Inspector Camera movement X+Y Direction PCB movement Stationary Parts inspection Soldering, Bridges, Solder Balls Imaging principle Synthetic Imaging, Spectral Analysis, Greyscale limits Imaging parameters Brightness, Hue

28l heller oven with not plates manual

http://www.hellerindustries.com/search.php?zoom_query=28l+heller+oven+with+not+plates+manual&zoom_page=26&zoom_per_page=10&zoom_and=0&zoom_sort=0

not . Procured specially prepared components with no lead metalization. Either tin, palladium silver or nickel. For BGAs, removed tin/lead balls and re-balled with tin/silver balls

Automatic

http://www.hellerindustries.com/search.php?zoom_query=Automatic&zoom_page=3&zoom_per_page=10&zoom_and=0&zoom_sort=2

. The system software provides automatic definition of the gray scale level in the image to define the outline of all the BGA solder balls shown on the screen

YAMAHA SMT used machine,chip mounter - YV100XG - QYSMT

https://www.qy-smt.com/product-item/yamaha-smt-used-machinechip-mounter-yv100xg/

) Using 2 high resolution multi-vision digital cameras 7) Continuous solder ball recognition for CSP/BGA components, including the determination of the defect of solder balls 8

BGA Rework Station - ML-5860 - QYSMT

https://www.qy-smt.com/product-item/bga-rework-station/

. If you wipe so much, it will cause connected welding, on the contrary, it will cause null welding. In order to wipe off dust and impurity of tin balls, and enhance welding effect, the welding paste must be wiped equally. 7 welding.So you need to extent time of third 、forth temperature zones or add the bottom pre-heating temperature to make ,the tin balls meltdown and drop evenly. (2) short circuit : When the ball reached the melting point,it is in a liquid state , if too long or too high temperature and pressure,it will destroy surface tension of solder balls and the supporting role, resulting

BALLUFF AG - LÖSUNGEN FÜR DIE MIKROELEKTRONIK Ι Essemtec

https://essemtec.com/news/newsansicht/-/-/balluff-ag-loesungen-fuer-die-mikroelektronik/

müssen parallel gefahren werden können. Balluff spezifisches Medium Balluff zertifiziert Fluxhöhe der Balls: 1/4 - 2/3 des Balldurchmessers  Fluxhöhe muss +/- 5 Höhe der Benetzung der Micro Balls wiederholgenau und stabil zu gewährleisten. Die mit einem Fluxdepot gefüllte Rakeleinheit fährt nun über das Dippingnest und Beschädigung aufweist resp. der Fluxprozess sauber abgefahren wurde und alle «Balls» vorhanden sind. Bild 5: Fluxereinheit auf einer Essemtec Fox Balluff entschied sich schlussendlich

BALLUFF UND ESSEMTEC: LÖSUNGEN FÜR DIE MIKROELEKTRONIK Ι Essemtec

https://essemtec.com/news/newsansicht/-/-/balluff-und-essemtec-loesungen-fuer-die-mikroelektronik/

. Balluff spezifisches Medium Balluff zertifiziert Fluxhöhe der Balls: 1/4 - 2/3 des Balldurchmessers  Fluxhöhe muss +/- 5 μm genau sein Die Fluxnester . Die Platten haben zudem eine Tiefentoleranz von +/- 5 μm um das Auftragen des Fluxmaterials und die Höhe der Benetzung der Micro Balls wiederholgenau und stabil zu gewährleisten Beschädigung aufweist resp. der Fluxprozess sauber abgefahren wurde und alle «Balls» vorhanden sind. Balluff entschied sich schlussendlich

Leadfree

http://www.hellerindustries.com.cn/leadfree.pdf

not. ♦ Procured specially prepared components with no lead metalization. Either tin, palladium silver or nickel. ♦ For BGAs, removed tin/lead balls and re-balled with tin/silver balls

The Last Will And Testament of the BGA Void

http://www.hellerindustries.com.cn/last-will-of-bga-void.pdf

] Investigation Specifics:  Various Ceramic and Plastic BGAs/CSPs, daisy chained, 0.3mm – 0.889mm (12 mil – 35 mil) diameter solder balls  SAC305 solder paste  Test vehicle: 3.17mm thick (125 mil , the specific BGA containing the void was shown on the inspection system screen. The system software provides automatic definition of the gray scale level in the image to define the outline of all the BGA solder balls shown on the screen. The software also

Reinigung von BGAs nach dem Balling - BGA / CMO - ZESTRON

http://www.zestron.com/de/anwendungen/leistungselektronik/reinigung-von-bgas.html?amp%3BItemid=63&amp%3Bview=article&option=com_content

. In der Regel werden dabei vorgefertigte Balls per Flussmittelpaste mit dem Sockel verlötet. Durch Reinigung können hier insbesondere Gefahren wie elektrochemische Migration

Reinigung von BGAs nach dem Balling - BGA / CMO - ZESTRON

http://www.zestron.com/de/anwendungen/leistungselektronik/reinigung-von-bgas.html?itemid=63&option=com_conten

. In der Regel werden dabei vorgefertigte Balls per Flussmittelpaste mit dem Sockel verlötet. Durch Reinigung können hier insbesondere Gefahren wie elektrochemische Migration

Microsoft Word - 355-35_LF_TDS_d.doc

https://qualitek.com/wp-content/uploads/2017/06/355-35_LF_TDS.pdf

. Qualitek 355-35 is formulated to remain active after the chip wave, eliminating the formation of solder balls. 355-35 is highly active flux with good through-hole performance

Microsoft Word - 355-35_LF_TDS_d.doc

http://qualitek.com/wp-content/uploads/2017/06/355-35_LF_TDS.pdf

. Qualitek 355-35 is formulated to remain active after the chip wave, eliminating the formation of solder balls. 355-35 is highly active flux with good through-hole performance

optical coordinate measuring machine-PCB magazine loader,PCB Multi Magazine Loader,pcb conformal coa

http://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/505.html

.  Optical coordinate measuring machine Instrument features: Measurement of geometric elements, including points, lines, planes, circles, balls, cylinders, cones, etc

optical coordinate measuring machine-PCB magazine loader,PCB Multi Magazine Loader,pcb conformal coa

https://www.ascen.ltd/Products/PCB_board_assembly_system/vision_measurin/505.html

.  Optical coordinate measuring machine Instrument features: Measurement of geometric elements, including points, lines, planes, circles, balls, cylinders, cones, etc

http://versatecsolutions.com/pdfs/brochure_cs400e.pdf

. The board clamps use tooling balls from .078” to .156” diameter. This yields excellent PC board positioning accuracy, while facilitating quick PC board changeover. Accuracy

Technical Sessions | SMTA International

http://smta.org/smtai/tech.cfm

the ultimate reliability of 0.3 mm pitch CSP assemblies. Also, in this session the use of polymer cored balls was evaluated on CSP packages which resulted in a 70% improvement in drop testing and 25% improvement in thermal cycle testing. The process used

Tutorials | SMTA International

http://smta.org/smtai/tutorials.cfm

. Topics Covered Recipe and profiles Properties of solder paste Metals and flux Profile shapes Defect identification and mitigation Solder balls Opens Voids Tombstoning T6

Speedline Electrovert Omni Excel 10 reflow oven

http://ce-exchange.com/detail/electrovert-omni-excel-10-reflow-oven-5745.cfm

. Configured to maximize efficiency, FES units feature filter technologies such as micromesh screens, for collection of large particles, and/or packed stainless steel balls that create a wet filter for solvent collection

Speedline Electrovert Omni Excel 10 reflow oven

http://ce-exchange.com/detail/electrovert-omni-excel-10-reflow-oven-6213.cfm

. Configured to maximize efficiency, FES units feature filter technologies such as micromesh screens, for collection of large particles, and/or packed stainless steel balls that create a wet filter for solvent collection

BGA Solder Ball Reinforcement

http://www.nordson.com/en-us/divisions/asymtek/solutions/Semiconductor-Packaging/Pages/BGA-Solder-Ball-Reinforcement.aspx

) and No Flow Underfill Thermal Compounds 3D Packaging BGA Solder Ball Reinforcement Simple method to improve solderball reliability by applying a polymer around the balls prior to assembly . Polymer materials are applied around solder balls to improve the reliability of area array devices, like BGAs, that are not underfilled . Jet dispensing of polymer material provides an excellent method of applying just the right amount of material around the balls.   Exact amounts of material can be deposited between solder balls, but typically coverage of the ball ranges from 25% to 75

Semiconductor Packaging: Semiconductor Equipment & Other Solutions | Nordson ASYMTEK

http://www.nordson.com/en-us/divisions/asymtek/solutions/Semiconductor-Packaging/Pages/Semiconductor-Packaging.aspx

. BGA Solder Ball Reinforcement Simple method to improve solderball reliability by applying a polymer around the balls prior to assembly

GLEN JEWEL BROCH MECH

http://bajabid.com/wp-content/uploads/2016/09/JB-70Tbrochure.pdf

. Dimensional view of solder balls pinpoints the precise location of solder voids within the balls. Die attach, showing voids in the epoxy connecting the silicon to the metal lead frame

No Job Name

http://ipc.org/TM/2-1-01F.pdf

]). 4.18 Polishing lubricant. 4.19 Specimen etching solution (see 5.5.2.1). 4.20 Cotton balls and swabs for cleaning and etchant appli- cation

J-STD-001DS w/amendment 1

http://ipc.org/4.0_Knowledge/4.1_Standards/J-STD-001DS-Amend1.pdf

(as changed by this Addendum) 7.6.14 Surface Mount Area Array Packages These criteria are intended to apply to devices with solder balls that collapse during reflow. For devices where the balls are not expected to collapse or for devices using column grid inspection can be used to a limited extent, but evaluation of X-Ray images shall be used to allow assessment of characteristics that cannot be accomplished by normal visual means (e.g., misalignment, voids, missing balls). Visual inspection requirements , solder splash, dross, wire clippings, solder balls or other metal particles, etc. Solder balls are allowed if proven secured (i.e., will not come loose in operation of the system) with a specialized process that has documented procedures which are available for review. Solder balls cannot violate minimum electrical spacing. 100% verification of secured solder balls is required, sample verification is not allowed. Objective evidence for all solder balls accepted shall be maintained and be available

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