Electronics Forum | Tue Apr 03 12:35:08 EDT 2012 | deanm
We have the same machine running the same alloy and have not seen this problem, but we're not running it nearly as much as you do. Have you asked Pillarhouse what could be happening? Try sending photos to them. They have been helpful in the past.
Electronics Forum | Tue Apr 03 13:28:11 EDT 2012 | davef
Is this related to this specific machine or this product? * Is this machine having a tough time regulating pot temperature? * Is this product dragging-out solder from the pot when it is being run so quickly? * Is this board out-gassing to create thes
Electronics Forum | Thu Jun 28 09:43:25 EDT 2012 | ssupertuba
I'm sorry. These are SMT caps such as a C0805C271J1GAC. Small 0805 caps. I know they gennerally give you solder balls that sit on the side of those parts but they wash off.
Electronics Forum | Thu Jan 31 15:31:00 EST 2013 | rjohnston58
Are the conditions (Bullets) under the IPC Acceptable and Defect sections "ANDs" or "ORs"? In other words, does every condition under a section must be meet to be Acceptable/Defect or meeting any one condition suffices?
Electronics Forum | Fri Mar 22 12:57:30 EDT 2013 | bandjwet
Does anyone have any "tricks" for getting all of those little pieces of paper removed from the pad/ball side of a BGA after reballing. We are using the paper preforms and there are lots of those little preform remnants everywhere!
Electronics Forum | Thu Apr 25 21:36:07 EDT 2013 | ultimatejoker
Hi, thanks for the pictures. May I know in the first picture what are those numbers (i.e. 280, 290, 300, 310, etc) represent?
Electronics Forum | Tue May 14 16:59:24 EDT 2013 | leeg
Cheers again. So if the bga is 1mm thick and with the balls 1.3 mm thick I should set the component height at 0.9 to be sure of cotrectly centering on the body ?
Electronics Forum | Tue May 14 21:40:23 EDT 2013 | ultimatejoker
What is the different between SAC and LF Solder Alloys?I found out that LF38 is SAC105 and LF45 is SAC305. Is it because LF is some standard international name for particular country?
Electronics Forum | Mon May 27 16:17:30 EDT 2013 | nikyta
Hi Eric, you have the right reduction on the stencils apertures? Also, a very oxidized solder paste can -and will do- promote and increase both the tombstoning as well as the solder balls.
Electronics Forum | Wed Jul 10 14:25:04 EDT 2013 | pankajp
thanks ben. any ball park number for weight of solder paste per pad? ( i understand this will be dependent on AREA of pad, but a rough estimate is good enough for me). -Pankaj
