Electronics Forum | Thu May 03 10:16:45 EDT 2001 | caldon
I like the Glenbrook x-ray systems. Simple and easy to use and they have a great support staff. We are using the Jewel Box 70 and are extremely pleased with it. They have complimentary software for analyzing the balls that is excellent. For the price
Electronics Forum | Tue May 08 21:13:04 EDT 2001 | Paul
My company is a low-volume high mix contact electronic manufacturer. We are currently looking at purchasing a pick and place machine that is capable of mounting such new components as microBGA's and other CSP's at such ball pitches as 0.5mm for examp
Electronics Forum | Sat May 26 05:11:43 EDT 2001 | Brian Sloth Bentzen
Dear Philip. BGA�s are very forgiven components when it comes to misplacement. In my experience, 1.27 mm ball pitch BGA�s, can be misplaces by up to 50% of the solder pad. They can easily be placed using only backlighted vision. It will however be a
Electronics Forum | Mon Jun 18 21:21:25 EDT 2001 | davef
Two things: 1 A flat surface will probably help the "balls on the socket sliding off the ridge of HASL" problem, but possibly consider less risky choices for your flat surfaces that immersion silver, like: OSP, ENIG, and immersion tin. 2 Don�t throw-
Electronics Forum | Mon Jun 18 18:14:59 EDT 2001 | davef
Would comment extensively on the following? The time is a fact for X-ray inspection. If you set the contrast, tilting angle correctly (provide you did enough cross section to know the few type of failure mode: e.g. smaller balls, shorts, missing on
Electronics Forum | Tue Jun 19 11:57:35 EDT 2001 | Gil Zweig
As you probably know, x-ray inspection has problems positivly identifying cracks or delamination. This task is more suited to scanning laser acoustical microscopy but the cost is very high. It has been our experience that cracks are associated with t
Electronics Forum | Mon Jun 25 10:06:35 EDT 2001 | dave f
are you saying to put a gap in between the board and the stencil? i have been fighting solder balls for a while now. sometimes i can fix them by placement "z" in the machines other times i can't. what should i have my oven profile look like? i have m
Electronics Forum | Mon Jun 25 20:51:43 EDT 2001 | davef
Well, the paste must be OK, because other components don�t have this problem. The board must be OK, because other components don�t have this problem. So, it must be either the component or the profile. I�d speculate that you need to do some work t
Electronics Forum | Tue Jun 26 20:40:36 EDT 2001 | davef
Your profile seems reasonable, as you say. As CPI says: Sure it could be planiarity issues with the balls, but that is not something that makes me want to do a Pete Rose belly-flop, head-first slide into first base that this is the source of your p
Electronics Forum | Fri Jul 13 08:25:03 EDT 2001 | caldon
You will need to prepare the component and site for rework. Using solder wick remove the solder from the pad site and the component balls. You can also use a heated Vacuum desoldering tool. To reball we have been using Winslow Automation reballing ki