Electronics Forum | Thu Apr 20 09:49:01 EDT 2000 | Dave
Why worry about the temperature if the top of the chip is 20 degrees C above eutectic - 183 C(at the balls)...if a machine works at convection oven temperatures, with high power, then there's no need to worry...Also, a CSP is a very forgiving chip.
Electronics Forum | Wed Jun 12 11:26:50 EDT 2002 | pjc
Sean, Have you contacted Speedline Technologies applications enegineers? They have a lot of knowledge about SPOTT working with customers over the years to develop the process. I myself have experience doing SPOTT. I used Fuji GSP2 printers with overs
Electronics Forum | Wed Mar 22 17:28:13 EST 2000 | Steve Harshbarger
Donnie, It's funny you ask this question. I just last month was at a company doing exactly what you are asking (Alpha 310 flux with infrared heating). They were successful, but they had 2 important things going for them. 1) A spray fluxer that wa
Electronics Forum | Fri Feb 25 14:34:44 EST 2000 | Ioan
Larry, the best paste thinner is the one that your paste supplier recommends. You should check with him. We have no problems removing the no-clean paste with alcohol. If you want to give it a try, make sure you use IP alcohol, not alcohol based flux
Electronics Forum | Mon Jan 29 11:11:29 EST 2001 | Casey Scheu
The solder ball collapse is associated with overheating. Of coarse there's no problem taking it off, your nuking it. The problem, as your aware, is in the replacement. The machine your using is overdriving the process. The key to this repair is in
Electronics Forum | Thu Feb 22 20:53:44 EST 2001 | davef
You're not sposed to pull the mask from the BGA when reworking it!!!! ;-) Well, if you insist. You can be as fancy as you want. Basically, all you need to do form a dam to prevent the solder from flowing from the pad to the via and starving the
Electronics Forum | Mon Mar 12 10:13:43 EST 2001 | CAL
At APEX I was able to witness the BEAM WORKS Selective Laser Soldering machine operate.Truly impressive. When they told me they could solder a BGA component, I old them they were HIGH as a kite. The board they demonstrated had 4 BGA's on it. When the
Electronics Forum | Fri Apr 06 08:35:20 EDT 2001 | brownsj
You can buy plenty of paste height measuring systems today, ranging from full 3D laser systems to systems using an oblique light line which will measure the paste height only. I found that the lowest cost option was to attach a DTI to the focus contr
Electronics Forum | Thu Apr 05 22:24:32 EDT 2001 | davef
I think your solder mask is a partial cause of your solder balling. Additionally, adjusting some machine set-up parameters may also help. 1 If we were talking about a single assembly problem, we�d be thinking about the laminate, but since you say t
Electronics Forum | Mon May 07 15:13:03 EDT 2001 | jdtpfacreate
Singh, The equipment varies in price. We make a wire bonder called the HW27U-H Wire Bonder. This is a gold to gold wire ball bonder. The substrate size you mention is within the area we can take into the machine. The key is the bonding area.
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