Electronics Forum | Wed Jun 02 07:28:03 EDT 1999 | Earl Moon
| I am currently sourcing equipment to mount CSP devices. I have looked at the GSM Flexjet & also the Siemens 80 F series. However these machines only look for ball presence not ball deformation. Panasonic are the only ones who have a 3-D camera capa
Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Jan 20 20:01:27 EST 1999 | Tony Arteaga
| | Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then pro
Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Sat Jun 18 08:03:58 EDT 2005 | davef
kenscj: Responding to your points of interest: * On the smoothness of BGA solder balls causing solder ball misalign, void, solder short after reflow: We expect the solder balls to be smooth and have no sharp irregularities. We can't recall attribut
Electronics Forum | Wed Jan 04 15:10:27 EST 2006 | grantp
Hi, That's the main problem. I quickly checked out the motorola document, and thanks for posting that, but the main reason for failure seems to be that the ball is not touching the solder pad. I wonder what kind of ball size tolerance they had on th
Electronics Forum | Wed Aug 16 13:52:24 EDT 2006 | russ
Oven settings are meaningless here. What does the board see? It is the paste we are concerned about not what the heaters are running at hehe. These solder balls are at the end of pad, which end? under the part or away from the part. I believe you
Electronics Forum | Thu Aug 24 15:37:50 EDT 2006 | Chunks
Hi Any, This is from an earlies thread "Solder Ball After Reflow Process". Date: August 16, 2006 01:52 PM Author: Russ Subject: Solder Ball After Reflow Process Oven settings are meaningless here. What does the board see? It is the paste we a
Electronics Forum | Mon Aug 04 16:20:35 EDT 2008 | patrickbruneel
After analyzing the pictures I don't think the solder balls are caused by the solder mask. If the problem would be solder mask related the solder balls would only show up on the solder mask but there are also solder balls on the plastic tabs. To me i
