Electronics Forum | Fri May 29 14:35:05 EDT 1998 | Steve Gregory
| We are getting solder balls after reflow of surface mount components. We are using a no-clean paste and a new jar seemed to help for a little bit. Any ideas? Thanks in advance Hello Ryan, There's a quite a few things that can cause solder bal
Electronics Forum | Mon Jan 28 16:12:47 EST 2002 | Joe B.
Dave F, thank you for your reply and the references you included. You asked why I'm trying to understand this info, here's an answer: I'm working on an NSF-funded materials-related project, one aspect of which may lead to some advances in the forma
Electronics Forum | Fri Aug 22 10:11:52 EDT 2003 | Stephen
An asteroid the size of texas is more likely to hit the earth than to get a BGA with one ball at the absolute max and another at the absolute minimum. The manufacturer is going to give themselves some leaway. What are you going to do about the more
Electronics Forum | Mon Apr 12 22:49:09 EDT 2004 | Ken
I will assume the balls of the device are tin-silver or tin-silver-copper??? There is no reason why you can not run 63-37 solder paste on this device. You will form an intermetallic at the interface structure, however, you will NOT form the 2/3 col
Electronics Forum | Sun Apr 03 10:07:40 EDT 2005 | davef
In 2001, IVF evaluated the reliability of IBM CBGA and CCGA, i.e. packages with "hard" balls and columns, in space applications for the European Space Agency. One clear result was that amount of solder paste printed on the solder lands is very critic
Electronics Forum | Tue Jun 20 11:31:15 EDT 2006 | muse95
This has been debated several times on this forum, but I have to say the opposite of Samir. I would rather see a SnPb BGA in a Pbfree process(as long as the component can take the heat) than a Pbfree BGA in a SnPb process. There has been some mention
Electronics Forum | Fri Aug 18 00:23:21 EDT 2006 | umar
Hi SWAG/Rush/Steve, Thanks for your response, Currently I am running with 811 lead paste. Actually this problem not only effect for one assy. I got 700 models runing at my company, but almost 50% of the model I have problem with solder balls issue.
Electronics Forum | Wed Jan 24 22:48:59 EST 2007 | frank63
Hello, we are facing some troubles with BGA opens in our production. PCB are both side popolated with BGA. BGA is array of 26*26, with some 6*6 center balls. PCB has 2 reflow processes, 4 pcs of BGA on each side. Now we are partly observing opens
Electronics Forum | Mon May 25 08:37:28 EDT 2009 | d0min0
Hello, recently we changed supplier of the LF BGA, we did corossection and now have doubts... previous BGA specs : pitch 1mm, ball diameter 0.6mm future BGA specs : pitch 1mm, ball diameter 0.4mm on the crossecrion we found that one of the ball seem
Electronics Forum | Wed May 19 09:28:09 EDT 2010 | speedyuk
HI Im new to this but i thought i would have a go at fixing my xbox 360 be re balling it,ive managed to remove the gpu and take all the old solder balls of and cleaned it up,then ive put it in a re balling jig with the 360 stencil fluxed the gpu wi
