Electronics Forum | Thu Mar 14 21:54:23 EST 2002 | alex_kirichenko
Try looking at your reflow profile. If he slope is too steep you may get solder balls. I've had the same problem, had to slow down the profile a bit. If you'd like, there was discution on wave soldering chart.. and Speedline one hase some points f
Electronics Forum | Thu Mar 28 17:54:57 EST 2002 | slthomas
I realize that this is sort of off-topic, but do you have scads of solder beads (mid-chip solder balls, whatever you like to call them) with that stencil design? If not, would you mind sharing which paste it is that you are using? Email if you like
Electronics Forum | Mon May 27 18:16:28 EDT 2002 | Carol Stirling
Hi, I'm looking for Temporary Stencils to assist placement using a Sniper Rework Station. The PBGA is a MPC555 Motorola with 272 pins. The ball map shows 4 populated outer rows, then 16 balls in the centre of an open, unpopulated area. Could I g
Electronics Forum | Tue Jun 04 12:26:40 EDT 2002 | Hussman69
If you have solder balls in vias on the "component side" it probably is your wave solder process. Most waves have an option that is designed to make sure your surface mount parts solder - but if turned up too high, can actually push solder up throug
Electronics Forum | Thu Jun 06 08:16:13 EDT 2002 | caldon
Jim- Sorry I can not offer advice on the Panasonic machine but do want to shed light on the Die and waffle pack issue. Take note that if the Die are loose in the pockets the balls or terminations could be damaged. The thin layer that the ball is atta
Electronics Forum | Wed Jun 19 05:16:21 EDT 2002 | hany_khoga
Dear all: I wonder how to avoid cracking the BGA if I want to remove it from the PCB assembly, re-ball it and solder it again. I need an answer considering: 1- The assembly could have been exposed to the ambient humidity for a long time. 2- The as
Electronics Forum | Fri Jul 12 03:05:30 EDT 2002 | Dreamsniper
Is there a standard with regards to the height of a PBGA ball diameter that will say that it has undergone a double drop ? What is the criteria of identifying that a PBGA solder ball has done a double drop and that it is acceptable or not acceptable.
Electronics Forum | Tue Aug 13 09:31:48 EDT 2002 | ksfacinelli
I am looking at placing a Altera BGA device that has a .45mm Nominal Ball Dia. with a .8 spacing c-c between balls. The PCB will be gold plated so co-planarity should not be an issue. Interested in suggestions that may assist producability when pla
Electronics Forum | Mon Oct 21 03:52:38 EDT 2002 | Ben
I'm doing lead-free SMT of BGA with 450 micron ball. I found there are lots of voids under xray, there are around 2-3 voids in every balls. It is around 10% of volume ratio. I would like to ask if anyone know there is any standard of acceptable maxim
Electronics Forum | Tue Feb 18 16:31:43 EST 2003 | arturoflores
Haran: Have you made improvements regarding your BGA shorts? We are facing the same problem and we think it is partly because the non coplanarity of the seating plane of the BGA which causes BGA balls to squeeze on one side of the BGA. Also, we ha
