Electronics Forum | Wed Jul 22 21:17:55 EDT 2009 | umar
Hi SMTnet Team, I had facing a lot of feedback from my customer interm of the solder splash and solder ball, After I check my process the issues came from manual soldering process. Is any one having the same problem with me ?, any one have solution
Electronics Forum | Fri Jul 24 07:43:56 EDT 2009 | davef
Your customer is correct. You are doing something wrong in your hand soldering process. Solder balls are a process indicator. Areas to assess are: * Moisture content of the bare board * Thickness of the copper plating in the through holes * Temperatu
Electronics Forum | Thu Aug 06 14:58:40 EDT 2009 | davef
Semiconductor fab back-ends and production contractors use laser assisted solder jetting for protoyping, repair, and other low volume flip chip bumping. * As you say, printing paste is going to be very tough to control. * Solid ball placement is ai
Electronics Forum | Tue Aug 25 07:13:20 EDT 2009 | davef
It sounds like the BGA balls are not melting. You're probably getting no collapse. Put a bare BGA on a hot plate. Heat it up until you get collapse. Adjust your reflow profile until you have that temperature on the BGA pads on the board. What is the
Electronics Forum | Mon Oct 19 07:39:15 EDT 2009 | m_imtiaz
Hi, We are facing solder ball problem in manual soldering process (between wire and terminal). we are using no-clean solder (63:37)and temperature setting in iron is around 400 Cel. Can any one suggest me how to solve this problem Any thoughts would
Electronics Forum | Mon Jan 18 14:01:47 EST 2010 | cl
Good Afternoon, Is this by chance a Pb BGA on a RoHS board? We had an issue with a Pb BGA on a RoHS board where we experienced "ball drop" on the Pb BGA. This was due to the heat required to reflow the RoHS paste. It was more than the Pb BGA could
Electronics Forum | Tue Jan 19 09:45:06 EST 2010 | pcbrookie
You nailed it. After some further investigation, it appears we had some old Pb version of this part that never got scrapped. Corrective action has been taken, and all the Pb parts have been disposed of. It makes sense that this would happen to the
Electronics Forum | Tue Aug 17 11:24:04 EDT 2010 | namruht
I have a question that has been discussed many times, but is always good to get some new insight. We have lots of issues with our no clean process. We use a Kester EP256 solder paste. I would just like to get some general tips on how to get rid of mi
Electronics Forum | Tue Aug 17 13:36:17 EDT 2010 | hegemon
Since you have home plated the apts and done solder reduction, I would take a look at your soldering profile. We have run into this before when running no-clean and found that reducing the initial ramp rate to the flux activation was a help in the
Electronics Forum | Tue Aug 17 14:34:27 EDT 2010 | davef
Comments are: * Too much paste ... reduce it more. * Do not let a traces run between small discrete pads or the heat of reflow will pull a ball to the trace, we can repeat this. * Change the placement height on chip parts to reduce solder spread / mu
