Electronics Forum | Fri May 29 15:17:14 EDT 1998 | Ryan
| Thanks Steve- Here is the whole story: The solder balls are appearing all over, similar to a splatter. They are relatively small. We are using H-Technologies S-HQ no-clean solder paste. The stencil is 6 mil and the boards are running in a ABW
Electronics Forum | Tue Apr 01 18:42:18 EST 2003 | rdr
Well, here is what I have found so far. I have removed the top of the BGA and found that the ball had detached from the package. Three balls were removed with the two adjacent balls pulling the pads off the board and stayed attached to the BGA while
Electronics Forum | Tue Jan 13 16:01:06 EST 2004 | russ
I believe that solder paste will need to be applied to this part. I have re-balled these in the past in a low volume situation and here is what I did and there appears to be no adverse effects to the component. Get a stencil (I use 8 mil for .032"
Electronics Forum | Wed Apr 27 01:20:22 EDT 2005 | Frank
Are you sure about your dimensions? .45mil ball diameter and .8mil pitch, and a body size of 16x8mils is really, really tiny. I assume you mean millimeters and not mils? 1mil = 0.0254millimeters If your stencil is 5mils and your ball diameter is
Electronics Forum | Mon Jan 16 16:19:22 EST 2006 | davef
Dunno. 4% higher standoff results in 16% higher reliability [�The Effects of Solder Joint Voiding on Plastic Ball Grid Array Reliability� Banks, Donald R., et al.; Proceedings of the Technical Program - Surface Mount International; September 10-12,
Electronics Forum | Thu Mar 29 13:15:18 EDT 2007 | adrian_nishimoto
We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using liquid or tacky flux does not always ensure proper wetting of the pads. Also The BGA sits closer to the PCB making cleaning and endoscopic inspection
Electronics Forum | Mon Jan 18 10:49:22 EST 2010 | pcbrookie
Hello all, One of our resistor arrays is becoming detached from its balls after reflow. This is the second instance of this happening. The balls are clearly soldered to the board, but the actual package is coming off (package pads are quite bare).
Electronics Forum | Sun Aug 30 16:36:31 EDT 1998 | Steve Gregory
Hi Kc! I went to Surface Mount International last week, and had a chance to see a way to reball BGA's that is very simple, and not expensive at all. I've seen the advertisements in a few magazines, but this was the first time I've seen it live. It's
Electronics Forum | Thu Jan 18 21:52:24 EST 2001 | arul2000
>>>>Dave, The BGA substrate surface finish is NiAu, while the PCBA pad surface is HASL. The solder ball composition is SnPb 63/37 and the solder paste used on the PCBA is also the same but with 2% Silver.>>> Dave, sorry I don't have the picture with
Electronics Forum | Wed Feb 02 20:53:34 EST 2000 | Dave F
Dennis: Several points: 1 If you're talking AlphaLevel process (?): � Good solderability, as HASL, even no-cleans bite well. � Planarity, uniform deposit, no bridgin� of FP. � Doesn't store as well as NiAu ... LT 6 months sealed � Very sensitive t
