Order by: Relevancy | Date
Apr 28, 2017 | i'd say its a ball nut. maybe it came loose or the balls are worn out. also, check timing belt! if r
Aug 4, 2014 |
Jun 10, 2014 | this is a Class II product. If I increase the openings... will I have random solder balls?
May 23, 2014 |
Apr 5, 2014 | The middle picture shows what looks to be solder balls littered across the surface. Turn-up the heat
Jul 8, 2013 | The smaller ball "missing" from the lower left is from solder migrating down into the adjacent via.
May 14, 2013 |
Apr 9, 2013 |
Oct 11, 2012 | Are the microvias in the BGA ball pads?
Sep 18, 2012 |
Sep 17, 2012 |
Sep 23, 2011 | Put the ball in their court and ask them to send you what specifications they are inspecting to.
Sep 7, 2011 |
Jun 10, 2011 |
Mar 21, 2011 | If there was a ball in cup defect on the original assembly then it could behave like you explained.
Feb 24, 2011 | HI I have this BGA short issue, I took x-ray image, the solder ball having big void. We suspect t
Jan 6, 2011 | Nitrogen increase surface tension in solder. This also reduces solder balls.
Sep 14, 2010 | There is problem with the alignment of BGA Balls. Check for any vibration. http://hubpages.com/hub/S
May 19, 2010 | Hello, I'm having problems with voiding on an assembly that has a GPS hybrid with balls much like
May 19, 2010 | Try stencilquik. Works good on PCB surface, not sure about component for BGA balls?
Dec 6, 2009 | Attached is the BGA BALL soldered underneath reflow profile , plz check and advice.
Nov 4, 2009 | It was 7 wt% according to the EDS spectrum at the EN layer near the ball-pad interface.
Sep 23, 2009 | larob57 Mike is not being a SA. The GPU in the XBox is packaged as a BGA [ball grid array].
Aug 25, 2009 | It sounds like the BGA balls are not melting. You're probably getting no collapse. Put a bare BGA on
Jul 22, 2009 | Hi Russ/Dave/Allen, Is the solder splash and solder ball is came from the same root cause?
Jun 24, 2009 | I have a used CP642 ball screw - in good condition firstname.lastname@example.org
Apr 23, 2009 | 25% void (total pcba inspected is 15 boards, each board has 2 BGAs and each BGA has 64 balls).
Sep 11, 2008 | Depending on the assembly, I have applied balls on LGA's and reflowed them on using the rework hot a
Sep 2, 2008 | use the 2009MLF from Interflux it will take away your solder balls. this is a known issue.
May 22, 2008 | No, absolutely not. The BGA balls should collaps by theirselves. No external pressure should ever
Apr 24, 2008 |
Mar 4, 2008 | Available on the web, JEDEC PUBLICATION 95, DESIGN GUIDE 4.14, Ball Grid Array Package (BGA), Figure
Sep 6, 2007 | Can voids be carried over from original voids in solder balls during reflow?
Aug 13, 2007 | Would I be correct in assuming that the solder used to attach the BGA ball to the device body should
Aug 13, 2007 | I am building a double sided SMT board. On the first side I have a 405 ball BGA. When we build and r
Jun 15, 2007 |
Feb 12, 2007 | yup, current SAC has a lot of problem with large BGA balls. Just like Wayne explained earlier.
Jan 17, 2007 | appears to be incomplete reflow on a couple of balls or they were moved during a cooldown. it also
Aug 24, 2006 | Paste flux exclusively, unless it is high temp ball Non reflowable), then paste is used. Russ
Aug 18, 2006 | PBGA is Plastic Ball Grid Array. Russ
Jul 29, 2006 | Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board
Jul 29, 2006 | hi everyone what does ball grid array and pin grid array mean? thank
Jan 25, 2006 |
Dec 9, 2005 |
Sep 7, 2005 | finest pitch requires ball bonding (gold) GS
Aug 22, 2005 | There's a lot of sources of solder balls. Search the fine SMTnet Archives for previous discussions.
Aug 22, 2005 | Sample Profile to avoid solder balls.
Aug 3, 2005 |
Jun 8, 2005 | You will have to machine the part off down to the top of the balls. Wick solder off from individual
Apr 6, 2005 | Are you saying you have solder balls (as in solder paste balls) at the lead tips (or land tip)? Thi