balls

"balls" search results in the Electronics Forums



2883 results found for "balls" in the Electronics Forums

Order by: Relevancy |   Date

solder defect

Sep 20, 2019 |

TIN LEAD SILVER BGAS

Dec 22, 2018 | My BGA is 0.5mm pitch with Sn66Pb36Ag2 ball. My PCB finish is HASL. Want to do reflow using Eutectic

DDR3 - BGA VDD and VDDQ Pins - Design Guidelines

Apr 5, 2018 | Recently we have seen the BGA Ball collapsing issue in the field. The unit has the clean manufacturi

Poor Wetting On The BGA.

Sep 18, 2017 | Besides the good advises above, I will add my observation. Your picture shows no ball collapse on an

Poor Wetting On The BGA.

Sep 16, 2017 |

GSM2 Y-axis resonance

Apr 28, 2017 | i'd say its a ball nut. maybe it came loose or the balls are worn out. also, check timing belt! if r

PIHR... what do you think...?

Jun 10, 2014 | this is a Class II product. If I increase the openings... will I have random solder balls?

Incomplete reflow

Apr 5, 2014 | The middle picture shows what looks to be solder balls littered across the surface. Turn-up the heat

BGA REWORK ISSUE

Jul 8, 2013 | The smaller ball "missing" from the lower left is from solder migrating down into the adjacent via.

Juki Laser Alignment

May 14, 2013 |

BGA pad size too large??

Sep 7, 2011 |

BGA solder bridge

Feb 24, 2011 | HI I have this BGA short issue, I took x-ray image, the solder ball having big void. We suspect t

Low Silver Solder Problems

Aug 25, 2009 | It sounds like the BGA balls are not melting. You're probably getting no collapse. Put a bare BGA on

BGA voids

Apr 23, 2009 | 25% void (total pcba inspected is 15 boards, each board has 2 BGAs and each BGA has 64 balls).

Land Grid Array (LGA) Rework

Sep 11, 2008 | Depending on the assembly, I have applied balls on LGA's and reflowed them on using the rework hot a

0.5mm CSP Reliability

Apr 24, 2008 |

Component Pin 1 marking

Mar 4, 2008 | Available on the web, JEDEC PUBLICATION 95, DESIGN GUIDE 4.14, Ball Grid Array Package (BGA), Figure

BGA dropping off underside of board

Aug 13, 2007 | Would I be correct in assuming that the solder used to attach the BGA ball to the device body should

Reflow Profile Design

Jun 15, 2007 |

To use a mini stencil, or not to use a mini stencil.

Mar 29, 2007 | We always apply solder paste to either the PCB pads or the BGA balls. I have found that only using

BGA opens / cracks

Feb 4, 2007 |

Lead free rework of BGA

Jan 17, 2007 | appears to be incomplete reflow on a couple of balls or they were moved during a cooldown. it also

BGA and PGA

Jul 29, 2006 | Ball Grid Array (BGA). A surface mount technology leadless package with the connectors to the board

Oop's Pb BGA's in a RoHS process?

Jun 21, 2006 | Hi Muse, what do you mean by "with a SAC Ball and SnPb Paste the ball liquifies at a much higher he

BGA reballing kit

Jan 25, 2006 |

BGA relow without solder paste?

Sep 20, 2005 | HLY: If you must build product while you wait to get the printer fixed, and if the BGA balls are eu

Solder Paste Flux %

Jun 13, 2005 |

Rework units with parylene coating

Jun 8, 2005 | You will have to machine the part off down to the top of the balls. Wick solder off from individual

Non-wetting: PTH on double-side reflow

Apr 6, 2005 | Are you saying you have solder balls (as in solder paste balls) at the lead tips (or land tip)? Thi

Does this forum covers BGA's

Feb 18, 2005 | Lead Free Ball Grid Array packages are expected to be increasing the shipment numbers by 2006. How m

Reball BGA process flow

Feb 9, 2005 | Hello, few comments: - what is the criteria to decide if re-ball or not a PBGA? - any electri

Use of Lead Free components With NonLead Free Solder Paste

Dec 1, 2004 | Hi, High temp solder balls don't collapse in current lead based soldering, so lead free balls are

Socket T,LGA 775

Aug 5, 2004 | The ball pitch is 1.10mm and the pad diameter is 0.45mm,so we designed the aperture diameter as 0.45

BGA ziff socket rework

Jul 30, 2004 |

Un-Reflowed Paste

Jul 26, 2004 |

No Lead BGA Hot Gas Rework

Apr 13, 2004 | I assumed the balls were tin/silver 221C or tin/silver/copper 218C liquiduous....but, this is obviou

Next generation soldering station - Metcal

Benchtop Fluid Dispenser