Electronics Forum | Mon Aug 27 22:48:21 EDT 2001 | dougk
Used an older model of the one you described. Have used Asymtech and Fuji's as well. The Camalot is accurate, reliable, and easy to program. The only things I disliked about it was that is was slower than the fuji's, and if the pressures weren't set
Electronics Forum | Tue Sep 11 10:13:58 EDT 2001 | davef
Yes, you cannot change the "subject" that you enter when first beginning a tread. This is what will appear on the Main Conference. You can change the very same "subject" as it appears when the thread is selected in one of the Forums with "edit" or
Electronics Forum | Fri Sep 21 11:59:26 EDT 2001 | Carol Stirling
We build IPC Class 3 product and are introducing Plastic Ball Grid Arrays. There is a possibility of out-soucing the build, so I'm interested in the Standards or Specifications the industry is quoting to ensure placement, inspection, reliability etc.
Electronics Forum | Sun Sep 30 00:54:06 EDT 2001 | chinaman
Has anybody heard about solder wires for rework with a V-notch in order to avoid solder balls which might be caused by shooting flux when getting hot. The notch is as deep to reach the core so that the flux can expand easily. I can imagine the effect
Electronics Forum | Mon Oct 01 03:46:57 EDT 2001 | wbu
Have never heard of solderballs during rework using solder wire. Noticed the tendency to have little balls of flux with too hot iron and lots of solder used for shields or massive cables to be connected. Seems to me a question of believe if it does
Electronics Forum | Wed Oct 03 12:02:04 EDT 2001 | kjwaskow
We are getting solder blobs forming in open areas of the BGA, between the center array and outer array. THe ceter array balls are starved of solder, so they are presumably the source. The theory we hold is possible moisture causing the solder to mo
Electronics Forum | Mon Nov 12 16:10:46 EST 2001 | davef
There is no doubt that we reflowed topside BGA on our wave solder machine. We run our wave pot at 450�F and that�s plenty hot enough to reflow solder on topside SMT components. When the solder balls on the BGA melt, the package is over 200�C, trust
Electronics Forum | Wed Nov 21 21:50:50 EST 2001 | Glenn Robertson
Tony, What you are seeing can occasionally be caused by gaps in the plating of the blind vias. If they are not "airtight" you can get moisture coming from the laminate that shows up as voids in the solder balls. You might check on the board sup
Electronics Forum | Tue Nov 27 14:24:13 EST 2001 | mparker
Short term fixes can be: have the vias "plugged" with solder by the fab house. This works if your fab is HASL finish. Tent the vias with solder mask, top side only. You may get a flux entrapment issue in the vias with this manner. Long term fix can
Electronics Forum | Tue Nov 27 15:25:51 EST 2001 | Ken Lester
Options that may help. Do you use a Vibratory Wave if so try reducing. The solder temperature shouldn't be to high. I would suggest 485F but is process dependant. Try slowing the preheat cycle this also may help. because this is variable I would try
