Electronics Forum | Wed Apr 28 15:08:10 EDT 2004 | russ
This could be a long shot but here goes. I have found that if flux is applied in excess that it will actually "move the solderballs" during reflow. I have actually seen where the balls are completely outside the package and oviously there are short
Electronics Forum | Tue May 04 14:27:32 EDT 2004 | michasm2
Both are acceptable methods. - Printing on the board may give your operators a better ability to catch insufficient solder due to poor release; however if done right, printing directly onto the BGA ball is much more efficient and eliminates any compo
Electronics Forum | Fri May 07 20:08:39 EDT 2004 | Ken
...um also, don't forget that ther are planarity issues associated with BGA devices AND bow-and-twist issues with PCB materials. An example I have one BGA device that has a ball planarity of 7 mils!!! Ant that's the OEM specification! THis will re
Electronics Forum | Fri Jun 04 18:18:28 EDT 2004 | gabriele
Hi Ricardo, You should complete the question with more details like : - kind of components pkgs (Chips, SO,TSOP,QFP,BGA,CSP,etc) and % of them versus the total (400) - tech complexity of components (0402 ? Finest Lead and ball Pitch ? SMT conne
Electronics Forum | Tue Jun 15 09:26:00 EDT 2004 | johnthor
There was a thread in the IPC TechNet a few days ago about this subject. Basic conclusion was that there is a reliablility concern if the lead free balls don't reach liquidus with the Pb profile. Haven't tried it myself. John Thorup
Electronics Forum | Tue Jul 13 00:40:44 EDT 2004 | Darren
Yes of course we are doing placement of BGA's with an IPII. However there is no front lighting so you can not inspect the balls. If the silhouette is square enough there is no problem with alignment. Just use the largest nozzle that will fit on the p
Electronics Forum | Sat Jul 31 08:52:15 EDT 2004 | g2garyg2
I am soldering with a softbeam laser and often get a flux/solder build up at the end of the feed tube. Seems better when we use Senju wire but this is very costly. It seems like we have tried everything to resolve this. Would appreciate assistance on
Electronics Forum | Wed Aug 04 16:46:40 EDT 2004 | davef
We assume this is different discussion that the discussion about "crystallized flux under BGA". Correct? Milky residue with water washing makes us think "noclean flux res that just got washed". We know what you said, but we can't help ourselves.
Electronics Forum | Wed Sep 15 13:55:06 EDT 2004 | dave
Due to some reason there are few balls of the BGA left open during the process. Reflow profile has been verified. There are other BGAs on the PCB and they are fine too. The BGA in question has a very large metal heat sink on top of it and is placed r
Electronics Forum | Tue Sep 28 09:15:03 EDT 2004 | DenisM
Can anyone share with me the price you pay for LF solder paste? I have a chinese brand on hand that is purported to reflow well in air and leave shiny joints and minimal solder balls. It does not flow like lead based solder of course, nothing does.