Electronics Forum | Fri Feb 19 05:14:04 EST 2016 | truewanderer
Hi, i have a confusion to read the dimension of BGA package from the datasheet. I have attached the datasheet below. Is this diameter of the ball 0.30mm or 0.15mm. I'm confused about the values given in the box. Whats meant by M, S, A and B. Please g
Electronics Forum | Tue Feb 23 04:54:54 EST 2016 | truewanderer
Hi, i have a confusion to read the dimension of BGA package from the datasheet. I have attached the datasheet below. Is this diameter of the ball 0.30mm or 0.15mm. I'm confused about the values given in the box. Whats meant by M, S, A and B. Please g
Electronics Forum | Wed Jul 06 06:17:11 EDT 2016 | pavel_murtishev
Dear members, Recently we have found that solder mask thickness variation could lead to solder balling under QFN packages for a high reliability device. Is there any industry proven method for solder mask thickness checking? Any equipment or any me
Electronics Forum | Mon Sep 19 21:35:54 EDT 2016 | shriram
Appreciate your suggestion. NSMD pads are used for this design, the anomalies we found are 1. the trace running between pads has a lesser solder mask height compared the other area of the pads. 2. the NSMD pads doesnot have a trench close to pad e
Electronics Forum | Fri Sep 30 10:37:35 EDT 2016 | ttheis
We sometimes have a misprint and we would never re-print on a board with paste on it already because it will surely get paste all over the bottom of your stencil and could smear between traces. If we do mispront we have to clean the paste off the boa
Electronics Forum | Fri Mar 03 13:39:39 EST 2017 | proy
Just about to set up a lead free solder pot exchange system for my Electrovert. Wondering if anyone has had success using say large ball bearings or materials which will sit inertly in the bottom to occupy space and reduce the alloy required without
Electronics Forum | Wed Aug 09 11:59:19 EDT 2017 | dleeper
As you already know, it depends on the paste. There isn't really a rule of thumb, but less time exposed it better. The issue is the flux exposure to the air and ambient conditions. The flux can evaporate or absorb moisture from the air. If the paste
Electronics Forum | Sat Aug 03 03:28:16 EDT 2019 | alexeyzb
We use SNPb for such applications (PCBA for aircraft). We tried SAC305 but recieve no good quality, so now only SNPb. If you will find good solution - please write. Because now we have some problems with BGA - no SNPb balls. And need to reball (addit
Electronics Forum | Wed Aug 29 03:16:20 EDT 2018 | cannizzaro
It is recommended that the thickness of the stencil of 0.1mm, the steel mesh should be partially nano-coated. It is best not to dry easily, and the particles are not easy to be too large. I have tried ALLPCB for this kind of BGA in the past and they
Electronics Forum | Wed Feb 06 07:18:47 EST 2019 | SMTA-Bob
I am looking for some old scrape boards that have either CCGA or CBGA, high temp columns or balled devices for some process experiments I am doing. If anyone has some please let me know, the company name or supplier will not be see or used Many than
