Electronics Forum | Wed Aug 06 04:11:56 EDT 2008 | chrispy1963
GR@ICS, can you be more specific about your up in the Ersa machine please? Nozzle size, pump rate (%), and is your machine equipped with monitors on the solder pots? We have the same machine it sounds like, however we run Pb-Free in both pots. I
Electronics Forum | Tue Aug 26 12:52:04 EDT 2008 | circleprime
I have recently started to use RMA flux (customer requirement) for some of our projects. I am finding that some of my BGAs are slightly off. Not enough to be rejected but enough to cause concern. In the past I have been able to rely on the surface te
Electronics Forum | Tue Sep 16 16:16:12 EDT 2008 | ck_the_flip
Yes, this scenario is fine. However, BGAs are a different story since the ball is the bulk of the solder joint. In this case, you MUST run a "hybrid profile". Look it up in the fine SMTNet archives (keyword: hybrid profile). I have "been there an
Electronics Forum | Wed Oct 15 21:53:59 EDT 2008 | mariss
50%) is high. With high humidity, there is also minor amount of spatter (10 to 20 'balls' per board). It is this that I would like to eliminate. I'm just a small guy running a young company here in Tustin, CA. Our product is very profitable and we
Electronics Forum | Tue Nov 04 07:50:14 EST 2008 | davef
Sure. Here's what you should do to apply repeatable amounts of flux on BGA during rework: * Squirt some gel flux on a plate or something like that that has a flat bottom and raised sides to corral the flux. * Cut notches into one edge of an old credi
Electronics Forum | Wed Dec 03 14:17:50 EST 2008 | muse95
I am not disputing that cotton gloves are a good idea. They can help protect a lot of parts and surfaces (if the gloves are kept in good clean condition, that is, but that is a whole 'nother thread topic). The fact of the matter is though, paper w
Electronics Forum | Mon Nov 24 11:19:21 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
Electronics Forum | Mon Nov 24 11:26:08 EST 2008 | sjones
I am having problems soldering a Rohs compliant BGA ATMEL AT91RM9200(rohs compliant board) This device recommends a soldering profile from J-STD-20 and a minimum peak package temperature of 250 centigrade,peak 260. However a lot of the other componen
Electronics Forum | Wed Jan 28 21:47:56 EST 2009 | padawanlinuxero
Hello! I am having trouble with the new changes from lead joint to lead free joint, we are working on change to lead free, I am using a 3 zone oven reflow, the zone temps are : zone 1 zone 2 zone 3 (top and bottom) 128 208 260 th
Electronics Forum | Tue Apr 28 08:51:35 EDT 2009 | davef
This is a snip from an ealier post here on SMTnet. Generally, solder pastes are comprised of: 90% solder powder, 5% flux, 4% solvents, and 1% activators [by weight]. Where: * Solder powder, when reflowed, is a metal bonding agent that mechanically
