Electronics Forum | Tue Nov 19 02:59:24 EST 2002 | yngwie
Hi Experts out there, pls help me with the following matters. How important is the bare PCB baking ? What is the temperature for baking @ what RH ? What would be the impact for the ENTEK finished board should the baking is really necessary ? For t
Electronics Forum | Tue Aug 26 03:48:44 EDT 2008 | eyalg
Does anyone know if the IPC 610 standard call for baking bare boards (PWB) prior assembly? Note: I am talking about bare boars only and NOT plastic packages components, Regards. Eyal Green
Electronics Forum | Wed Nov 20 16:53:18 EST 2002 | davef
Q1: How important is the bare PCB baking ? A1: Baking boards is a non-value added activity. Q2: What is the temperature for baking @ what RH ? A2: Search the fine SMTnet Arcives for bake recipes. Q3: What would be the impact for the ENTEK finishe
Electronics Forum | Thu Nov 21 14:17:27 EST 2002 | MA/NY DDave
Hi I can't give you the answer for your question because I have too many questions and would have to know a lot more before I was comfortable giving any advice. I have done mass Baking of piles of PCB's as a needed evil when piles of boards were ex
Electronics Forum | Fri Nov 22 08:57:56 EST 2002 | davef
Q1: What do you mean by "if the board is manufactured properly"? A2: If the epoxy is noy cured prooperly, for instance, the copper will not be well attached to the glass. So, peel strength will be lower. Q2: I don't believe that the peel off/or lif
Electronics Forum | Tue Aug 26 07:44:06 EDT 2008 | davef
Industry-wide, there is no current requirement for baking of bare boards. It adds no value. * IPC-HDBK-001 has guidelines olden times. * IPC-TM-650 has several test methods to determine moisture resistance to both liquid immersion and absorption from
Electronics Forum | Wed Nov 20 21:04:15 EST 2002 | yngwie
Hi Dave, What do you mean by "if the board is manufactured properly". If the board is not manufactured properly, humidity will have an impact on the peel strength? Is that what you mean. How does the Humidity impacted the peel strength ? Thru' which
Electronics Forum | Fri Nov 22 10:38:30 EST 2002 | slthomas
The follwing is from the Technet archives, per IPC's Jack Crawford. I dug it up during some investigation of a supplier's issues with humidity in an Asian plant: There is support for this in IPD-HDBK-001 w/Amendment 1 Handbook and Guide to Suppleme
Electronics Forum | Tue Oct 30 21:42:32 EST 2001 | surachai
I have question about board baking after in line washing machine then I would like to know some information that ; 1) Do we need board baking after in line washing machine? Both bare board and assembly borad normally we don't bake . 2)In case of ne
Electronics Forum | Tue Oct 15 10:12:44 EDT 2002 | davef
1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-brainer. Sometimes, based on the proximity of the MS components. >2)
