Electronics Forum: barrel and crack (Page 1 of 10)

Plating crack

Electronics Forum | Wed Sep 27 12:44:52 EDT 2000 | Ashok Dhawan

What could be possible resons for " Plating Crack on Barrel (tented via)" This tented via is in proximity to parts being hand soldered. The crack in barrel was detected on failure analysis - micro-section of via where barrel is having crack ( circul

Re: Plating crack

Electronics Forum | Wed Sep 27 19:37:32 EDT 2000 | Dave F

Wolfgang is correct. Copper plating thickness of the via barrel walls is a key question you need to answer to troubleshoot this. Tenting is a red herring.

BGA crack and strain gauge measurement

Electronics Forum | Wed Nov 29 01:12:12 EST 2006 | callckq

Dear Davef, Thanks for your input...The crack happen at the pad/solder ball interface..Pls review the new thread that I post just now with title called "BGA BALL CRACK AT PAD/SOLDER BALL INTERFACE" Thanks!

BGA crack and strain gauge measurement

Electronics Forum | Mon Nov 27 08:05:50 EST 2006 | davef

There is no standard for a strain gage measurement of allowable deflection of a board or a fixture. It's possible that your fixture is causing the BGA cracking that you see. What protion of the BGA is cracking? If it is the solder connection, sear

BGA crack and strain gauge measurement

Electronics Forum | Sat Nov 25 21:26:55 EST 2006 | callckq

Dear all, I have an issue here where we found BGA crack. Understand from friend, we need to study any possiblity of our own jig or fixture cause this problem via strain gauge measurement..My question: Is there any standard @ specification establish

Selective Soldering - Barrel Fill

Electronics Forum | Fri Oct 15 11:03:50 EDT 2010 | hegemon

Well, we got the baking part right at least. I would think that would help to rule out the barrel cracks allowing moisture escape. Plating too thin makes sense to me. In any case, do you think barrel cracking would be observable on a bare PCB?

rigid-Flex board via problems

Electronics Forum | Thu Jan 12 14:17:07 EST 2012 | blnorman

How are the vias failing? Barrel crack?

Selective Soldering - Barrel Fill

Electronics Forum | Fri Oct 15 08:01:12 EDT 2010 | patrickbruneel

What you have is blowholes. Baking your boards prior to soldering will help. Root cause is either barrel plating too thin or barrel cracks allowing laminate moisture to escape. Patrick

BGA and Gold Boards

Electronics Forum | Fri Jun 19 09:45:21 EDT 1998 | Mike Cox

Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. Mike

Dye and Pry

Electronics Forum | Sat Mar 15 01:03:10 EDT 2008 | callckq

All, What if BGA solder crack do exist after the shock test? Its happen at the corner of the BGA. Base on your experience, what are the potential root causes? Thanks, Sean

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