Electronics Forum | Fri Sep 19 11:39:38 EDT 2003 | joeherz
We have recently started building a new assembly that is exhibiting some strange behavior. We are seeing what look like blow holes in wave soldered joints. When the joints are touched up, the solder in the barrel will actually bubble up from the ho
Electronics Forum | Fri Oct 08 09:43:27 EDT 2004 | davef
First, don't get too excited about the thermal capabilities of conductive epoxy. An epoxy like DuPont CB-100 increases the amount of heat conducted through the barrel, but many over estimate what it can do. Calculations show for a 0.020" drilled
Electronics Forum | Mon Mar 12 11:27:35 EDT 2007 | coop
I am not using a solder pallet, I don't think the problem is contamination related, because these parts are on some of our other assemblies, and they're being waved with no problems. The problem seems to be mainly on our panelized boards for some rea
Electronics Forum | Mon Nov 19 09:34:50 EST 2007 | bbarton
Real Chunks...Yes, that's the most glaringly obvious defect in the short term (you'll probably find it on your production floor if it's really bad) but you may find that everything looks good short term only to have a high level of customer returns..
Electronics Forum | Fri Oct 22 19:34:56 EDT 2010 | hegemon
Thanks for the help guys. Nice to think I was basically on the right path. PCB manufacturer has finally conceded the barrel defects and is remaking the PCBs. We are big on pre-tinning the leads of TH connectors as well as providing some good pre
Electronics Forum | Mon Oct 03 11:33:09 EDT 2011 | artposada
I have been getting solder balls on the leads of a transformer that I am soldering to my pc board. My parameters are listed below. The board PTH's are .039 The transformer leads are .0255 square. My solder pot temp. is 310C Solder is Lead Free AIM
Electronics Forum | Tue May 23 22:23:20 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Tue May 23 22:21:13 EDT 2000 | JAK
Hi all, I'm would like to try intrusive reflow (pin in paste, paste in hole, etc.) on a connector using WS-609 solder paste (halide free, water-washable). I'm concerned about entrapped flux in the barrel of the solder joints. If there were to be e
Electronics Forum | Wed Apr 23 15:17:11 EDT 2003 | Robert
Let me see if I got this right. The OSP in un-plugged vias will break down after subsequent reflows and washes which can result in oxidation. Question: Is there any paper covering oxidation and reliability on such a condition. We are averaging .0007
Electronics Forum | Fri Jun 29 13:13:32 EDT 2001 | Brian W.
What workmanship standard are you working to? The IPC book has an allowance for boards with heatsinks or thermal masses that allow less than 75% barrel fill on through hole parts. I would suggest that you check your board layers and determine if yo
