Electronics Forum | Tue Mar 12 10:12:51 EST 2002 | steve_arneson
Wolfgang, I agree with your training concept. The idea that you need to look very closely at what type of equipment to choose is also very important. The key point is not to eliminate any of the options available based upon one view versus another
Electronics Forum | Fri Mar 15 16:06:30 EST 2002 | shan
80??? Whatever leads to you to that assumption? I'd love to see a study stating that. Based on experimental results at our facility, overvolume due to the screener parameters have rarely caused a solder short. so, in conclusion, does one need a solde
Electronics Forum | Mon Mar 11 11:11:38 EST 2002 | slthomas
Tahnk you for posting the charts. > > They look > very useful, but I have a silly question: In > reflow problems _ What is "leaching" ? Dissolution of the component metallisation into the liquid solder. _ > What is "Halo effect" ? "...a
Electronics Forum | Wed Mar 20 00:55:01 EST 2002 | ianchan
Heyz...at this rate i'am losing my mind too! We have been doing the "looks good; look bad" approach, and backed it all up with Z-height paste measurements. Only thing there's this customer QA asking how we established those USL & LSL utilized in our
Electronics Forum | Wed May 15 10:55:35 EDT 2002 | geoff_goring
As I thought..... This is probably why most journals and standards I have studied hold shy of even attempting to predict shelf life. They certainly hold off of any predictions when based on accelerated life testing too. The component lead is a cop
Electronics Forum | Tue May 07 07:38:13 EDT 2002 | ianchan
Hi mate, checked with one of our egg-brains in the factory (freakin' workaholic still around at this time of night), he tells me that Ag-based PCB finishings share rather similar reflow temperatures for normal Sn/Pb applications. this means (if he i
Electronics Forum | Tue May 14 15:49:30 EDT 2002 | dason_c
Thank! Francois. I think that I also had a paper from Lucent, Handling of Highly-Moisture Sensitive Components. Is it the one which you mention above? I just would like to figure out. Per Desiccant type dry box, it claim that it can absorb the m
Electronics Forum | Tue Jun 11 17:12:29 EDT 2002 | mdmilward
Hello, Can I please get some help on finding formulas for calculation of surface mount pad sizes for stencil design and solder paste deposition. I've recently joined a company who has allowed their stencil supplier to develop the stencils based upon
Electronics Forum | Fri Jun 14 20:46:40 EDT 2002 | kenbliss
Dave, you are ahead of me again. I was thinking that this morning. however it clearly is a problem for him and I based the rest on my experience, anything can be improved but at what cost. If nothing else he can get more boards off his line at the
Electronics Forum | Wed Jul 03 11:37:36 EDT 2002 | fmonette
Dason, I apologize if some of the information sounds redundant but I don't think I explained my point very well (and the standard can get really confusing at times). I definitely agree with using C-SAM to look for internal defects. My only advise i
