Electronics Forum | Tue Sep 25 13:01:48 EDT 2001 | Hussman
If the flux you are applying by brush is alcohol based, use some alcohol on a few failed PCBs and retest. It souldn't take a lot of flux to reflow the balls to a pad that's already covered with solder and flux from the first BGA - unless you are cle
Electronics Forum | Fri Nov 02 17:16:53 EST 2001 | davef
Planned maintenance is: * Scheduled based on the equipment supplier recommendations. These maintenance schedules may be modified based on clear-headed thinking that is documented. * Calibration may not be slipped, but the schedule may be moved up. [
Electronics Forum | Thu Apr 25 09:34:24 EDT 2002 | fmonette
Michael, By the way, the default bake duration should be 48 hours at 125C instead of 24 hours. The shorter duration was based on a standard that is now obsolete. The current revision of J-STD-033 includes a variable duration bake table, based on co
Electronics Forum | Thu Feb 28 05:21:31 EST 2002 | Andrew H Otwell
Hi, I'm helping to design a website and database of product information for the packaging and SM industry. We're at an early stage, and I'm interesting in learning as much as possible about how people like you (Design/Dev. Engineers, Researchers, or
Electronics Forum | Sat Jul 27 10:17:33 EDT 2002 | sam_b
Hello, I am looking into purchasing a rework system for BGA's. Contacted several manufacturers, both large and small, all seemed desperate to sell their stuff. I would need to be locked up in a nut house should I base my purchasing decision on the
Electronics Forum | Wed Aug 20 10:27:25 EDT 2003 | Dan Gosselin
Do any of you guys have a list of parts that cannot survive hanging upside down during reflow soldering. As our board designs become increasingly dense and higher speed, we need to use all available pcb real estate. This means locating parts we hi
Electronics Forum | Fri Aug 22 17:12:40 EDT 2003 | Stephen
read the other messages. I havn't seen this problem nor have I even heard of anyone seeing this problem. If anyone else has seen this on unreflowed BGA's I would love to hear it. At first I thought you meant that your QA department was finding the pr
Electronics Forum | Tue Dec 02 11:34:54 EST 2003 | caldon
Adam- I would touch base with the three people I have listed below. Touching base with each one will net you every thing about Vapor Cleaning Equipment you would ever want to know. Ultronix Carl Wolf 800-553-7881 zoc@ultronix.com www.ultronix.com A
Electronics Forum | Tue Apr 13 19:47:05 EDT 2004 | davef
Glue has different mechanical, thermal, and electrical properties than solder. That's why all these very nice no-lead people are furiously trying to gin-up some wacky solder alloy, rather than using glue. Among the papers in the SMTA Knowledge base
Electronics Forum | Sun Jun 13 07:57:15 EDT 2004 | Grant
Hi, We have been offered some lead free BGA parts in place of normal lead solder BGA parts in our process, and because we can get them faster it would be a good option. However does anyone know if we can use them as normal. I assume the balls won't
