Electronics Forum | Fri Jan 07 01:05:40 EST 2000 | Dennis O'Donnell
I suggest you check out as many vendor at first as possible. Price varies greatly depending on your requirements. Once you find a company that has a price range that you are comfortable with, most can provide you with their formula so that you can
Electronics Forum | Tue Dec 24 17:06:00 EST 2002 | MA/NY DDave
Hi, Lots of good answers and I am sure questions in the above. I have too many questions to really know whether your idea is a good one, as it could be, or one that will cause you more problems. Based on the size of the PWB that you will buy and t
Electronics Forum | Thu Dec 16 11:54:45 EST 1999 | Mike Naddra
At reflow an inert atmosphere is used to mitigate the occurance of oxidation, to me the decision weather to move from an inert atmosphere is based on several things ; PCB surface finish - are you using a HASL finish, OSP or another surface finish and
Electronics Forum | Wed Dec 15 04:59:40 EST 1999 | Joshua Hall
Hello KA, When producing in kind of PCB product you have to base much of your decision on cost effectiveness, time, and quality. In order to get the best of all three you have to decide which you want to be your top priority. By adding an epoxy to
Electronics Forum | Thu Dec 09 14:10:42 EST 1999 | se
Fiducial recognition is based on finding the centroid of the gray scale density of the fiducial. Round fiducials are easier for the software to digest in most cases, but its more important what the camera sees. Gray scale or color contrast of the fi
Electronics Forum | Thu Nov 25 20:28:43 EST 1999 | cklau
hello, One way to prevent copper land delamination is to applied Anchoring spurs also referred to as "tie-down tabs" or "rabbit ears".These are a metal projection around a land.This features is fully captured by the cover lay (cover coat) that is n
Electronics Forum | Fri Nov 12 16:59:58 EST 1999 | John Thorup
Hi Michael While driving home last night I realized the omission in my response. I thought someone would call me on it. I should have clarified that the dissolution of the gold into the joint would be affected by the thickness of the gold plating,
Electronics Forum | Wed Nov 10 18:02:54 EST 1999 | John Thorup
Hi Dave Sounds like what we call a "squeeze ball". Usually caused by excess paste squeezed over the mask between the pads of the component when placed. This sometimes escapes the pull of surface tension back to the fillet and escapes to the side, us
Electronics Forum | Thu Nov 11 11:03:40 EST 1999 | Andy C.
Horace , We had a similar problem last year on an Ultra 2000 . We cured it by draining the pot , removing the wave forming ducts , pumps and nozzles and cleaning . Refill with fresh solder ( one third solder chips , two thirds solder bars - to get t
Electronics Forum | Wed Nov 03 10:30:27 EST 1999 | John Thorup
Hi Anthony I'm not sure I understand your question. Do you mean move to a better or more precise placement or to an error or bad position? I'm not aware of any calculation that can predict movement since it is based on so many factors like component
