Electronics Forum: basic (Page 106 of 142)

Re: Flux Residue in Oven Vents

Electronics Forum | Mon Jan 18 17:58:09 EST 1999 | marc p

| I have a severe problem with flux residue being drawn up the vent ducts of my reflow oven. This residue reaches a critical mass then begins to flow down the ducts and becomes very messy. I run a no-clean process and use IR oven. Has anyone else o

White Residue / Vapor Degrease

Electronics Forum | Thu Jan 14 22:59:08 EST 1999 | Chris G.

I get white residue on my PCBs after vapor degreasing. No comments on the vapor degreaser. Yes, I still use one of these. I use a vapor degreaser and a 1,1,1 replacement solvent due to the quick clean and quick dry times. Anyway, I only get white

Re: White Residue / Vapor Degrease

Electronics Forum | Mon Jan 18 21:05:15 EST 1999 | Dave F

| I get white residue on my PCBs after vapor degreasing. No comments on the vapor degreaser. Yes, I still use one of these. I use a vapor degreaser and a 1,1,1 replacement solvent due to the quick clean and quick dry times. Anyway, I only get whi

Re: Solder Paste Shape Standards

Electronics Forum | Sat Dec 12 12:03:59 EST 1998 | Dave F

| DO you know of an Industry Standard that describes solder paste geometries requirements? | Lyle: The industry standard that describes solder geometries requirement is IPC-A-610. There is no industry standard that describes how solder paste shoul

Re: Bare board suppliers

Electronics Forum | Wed Nov 18 12:59:49 EST 1998 | Earl Moon

| Our company has been building high rel military products for over 15 years. Over that time we have reduced our bare board suppliers to two companies that specilize in 55110 QPL product. | | I am now faced with a requirement for 6000 4 layer boa

Re: Pick Place Program to BOM verification software

Electronics Forum | Thu Oct 29 12:12:48 EST 1998 | Barry Kauffman

| | | | Does anyone know of any software programs that will verify a Pick & Place program to the Bill of Materials (BOM)? Verify meaning the Part # and Ref. Des. matching of the two files. | | | | We use GCPlace to merge our BOM with X/Y file |

Re: Wave Outfeed Cooling

Electronics Forum | Fri Oct 23 15:44:57 EDT 1998 | Mike

| We've got a continous flow cooling problem from our wave solder process into ICT. Our current configuration is a flatbelt conveyor into a manual de-pallet process, operator then places on to an edge conveyor. We've tried muffin fans, look good bu

Re: Cleaning No-Clean

Electronics Forum | Tue Oct 13 18:28:51 EDT 1998 | Graham Naisbitt

Upinder, Using IPA does not cause the residue, it simply exposes it. Given that all fluxes leave reisdues, it follows that these MUST be benign - but how do you know, and how do you control it. You are using flux to remove oxides and give you a go

Re: Cleaning No-Clean

Electronics Forum | Thu Oct 15 13:55:43 EDT 1998 | Steve A

Dave, The first step would be to learn to accept the residue. IPC class 2 has no problem with it. If that is not possible, I am not sure why a no clean is necessary- but I will take your work for it. Alcohols will dry out the residue, and turn it

Re: Cleaning No-Clean

Electronics Forum | Thu Oct 15 16:39:07 EDT 1998 | Dave F

Steve: I thought Kyzen products were "additives" to either aqueous or semiaqueous inline or batch machine cleaning processes. I'm trying to clean the no-clean residue from a few components that can not bear to see water. Can you use Kyzen products


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