Electronics Forum | Tue Apr 04 02:46:39 EDT 2000 | George Verboven
We are looking for a way to cure conductive adhesive. I heard about curing times from 2 hours and more. But I also received information that curing can be done in 10 minutes at 120 C. Of course it also depends from the type of glue. But the question
Electronics Forum | Fri Mar 31 14:23:13 EST 2000 | JAX
Hey Dave, thanks for the sparkling endorsement! No really, You have to be realistic when presenting your case. Once you understand that company decisions, like it or not, are based on the bottom line, the way you present your case will be clearer. I
Electronics Forum | Fri Mar 31 14:24:10 EST 2000 | JAX
Hey Dave, thanks for the sparkling endorsement! No really, You have to be realistic when presenting your case. Once you understand that company decisions, like it or not, are based on the bottom line, the way you present your case will be clearer. I
Electronics Forum | Thu Mar 09 10:13:40 EST 2000 | Erick Russell
Hi Casey, I accept your BOLD Rework challenge. Considering you did not say what the TEST was. Let's base it on speed, thermal uniformity, and process repeatability. I have sample boards that I will take to APEX with Back to Back BGAs. Does anyone wa
Electronics Forum | Wed Jan 31 17:45:37 EST 2001 | dason_c
Hi! William, please check the new IPC-A-610 Rev C, para 12.4.10 for the soldeirng anomalies. Most of them may consider as process indicator and not the defect. The most common method to elimate the solder ball is to reduce the solder volume by red
Electronics Forum | Tue Feb 20 15:39:31 EST 2001 | fmonette
To my knowledge, the 40C was established as the maximum "safe temperature" for all tape and reel packaging. The actual specs may vary somewhat for different types of reel, pocket-tape, cover-tape but you must be concerned with the cover tape adhesive
Electronics Forum | Thu Mar 15 16:41:46 EST 2001 | jollyrodger
You guys are absolutely correct, and i thank you for your invaluable advice. I would like to know if there is any online manuals for the equipment i stated b4. I have tried so hard to find these with little results. However i did get onto th
Electronics Forum | Wed Feb 28 19:48:11 EST 2001 | davef
If we were talking about a single board problem, we�d be thinking about the laminate, but since you imply the problem is broad-based across multiple assemblies, consider the following machine parameters: * Crank-up preheat time / temperature to driv
Electronics Forum | Wed Mar 14 09:16:45 EST 2001 | gsmguru
In the past I've removed shields with a dedicated hot air machine. (Similiar to an SRT) This machine could remove and replace shields using a stereo microscope and a positioning system. Basically a special nozzle is designed for each type of shield.
Electronics Forum | Thu Mar 22 03:26:42 EST 2001 | moseschee
Hi Dave, Thank you for your reply.It means a lot to me. By the way, is it possible to have the analysed data on the study you mentioned regarding the solderability "conditioning " ? Can we establish the correlation of solder shelf life based on y
