Electronics Forum: basing (Page 276 of 312)

Re: gerber data vs bare board

Electronics Forum | Mon Sep 13 04:11:27 EDT 1999 | Earl Moon

| | hello | | | | having a problem with one customers bare boards not matching my stencil apertures. i design stencils based on gerber data and reduce up to 15% on some pads. do some board houses reduce pads after receiving gerber data???why would

Re: how to overcome tolerance in automatic alignment

Electronics Forum | Fri Sep 10 09:03:52 EDT 1999 | ScottM

| | hi, i m college student. i m currently doing my Final year project in PCB drilling. the main task is to design auto feeder which allign the PCB properly in position before drilling take place. the close tolerance becomes a big problem to the prec

Re: SMT productivity measurement

Electronics Forum | Thu Sep 09 15:40:21 EDT 1999 | Scott S. Snider

| Currently, I have been requested to measure our SMT productity, capacity levels. I employed "pcs/day" as a base to come out with | indicators for the top management decision-making. Anyone has | other ideas to measure these two items? | | What

Re: Cleaning of 'No-Clean' paste

Electronics Forum | Mon Sep 13 11:02:08 EDT 1999 | Bill Schreiber

Mike failed to list the company that introduced the first ultrasonic stencil cleaner in 1990. The company remains the leader in stencil cleaning worldwide: Smart Sonic Corporation Tel: 1(800)906-4407 Fax: 1(818) 909-6409 e-mail: smt@smatrsonic.com w

Re: I looking for a beta site for a new drying process

Electronics Forum | Thu Aug 19 14:06:07 EDT 1999 | Stu Leech

| | | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large sca

Re: I looking for a beta site for a new drying process

Electronics Forum | Thu Aug 19 14:52:13 EDT 1999 | John Thorup

| | | | | We have developed a new process for removing moisture from surface mount devices. We have one site where PCB laminate drying has been reduced to 1.5 hours. A standard oven took 4 hours to do the job. I am looking for a firm who does large s

Re: Component solderabilty

Electronics Forum | Wed Aug 18 05:09:56 EDT 1999 | Brian

| | We have a design on which there is an ASIC that will not be produced anymore in the future. As we want to make this design over the next 10 years we are evaluating the possibility to buy the necessary ASICs for the next 10 years. This will give u

Re: DENDRITES

Electronics Forum | Thu Aug 05 06:29:18 EDT 1999 | Graham Naisbitt

| | | We're getting field failures in a high impedance portion of the circuit. Think the unpopulated pc card has contaminates because we were able to grow dendrites by applying a 9 volt battery across the suspected pad, placed a drop of de-ionized w

Re: X-Ray for CSP devices

Electronics Forum | Tue Jul 20 09:59:22 EDT 1999 | Vikram Butani

Hi Steve, What Earl says is true. You need a stand alone failure analysis/process verification system before you go inline. No matter what brand you choose, it is important to compare a few features, across the board: - X-ray source kV, mA, and f

Re: uBGA

Electronics Forum | Tue Jul 13 13:51:51 EDT 1999 | Earl Moon

| | | Hi all , | | | | | | We are trying to implement the micro-BGA technology at our plant. I need the clarification to the following points: | | | | | | 1. Is underfill required for micro-BGAs? | | | | | | 2. What type of stencil apertures are t


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