Electronics Forum: basing (Page 81 of 312)

IPC Class II and Class III reliability

Electronics Forum | Thu Apr 10 15:20:35 EDT 2003 | MA/NY DDave

Hi DaveyF, Thanks You see, you proved my point, with piles of more information than I gave. Based on Application rather than design and manufacturing specifications, a lower IPC class can out perform another. So our starting Poster must look at t

Tombstone defect

Electronics Forum | Mon May 05 11:35:00 EDT 2003 | Grant

Hi, This is an interesting point. I use Koki paste from Japan, and it's wonderful, however what properties of solder paste would make it "anti tombstone" paste? How does led free effect tomb-stoning? That would be interesting to know. We might go

HSP Utilization

Electronics Forum | Fri May 16 08:13:26 EDT 2003 | radney

We are a mixed volume facility and we are doing our utmost to achieve 55% utilization on HSP's (UIC 4797's and 4791's) We are basing this on a world class metric. I am wondering if anyone else out there is measuring utilization, what sort of result

Contract manufacturing Question

Electronics Forum | Fri May 30 17:20:53 EDT 2003 | jonfox

Is this setup charge the cost of purchasing the required materials? I left that out of my previous post. As far as manufacturing cost, usually they add up the cost of machine time (leased or owned), operator time (wage based), and the size of the o

Leadfree component plating on Sn/Pb paste

Electronics Forum | Mon Jun 23 11:02:33 EDT 2003 | Kris

Hi, No Major issue using lead-free plated components in tin-lead as long as Sn/Bi is not the finish. I think some customer might be worried about low melting phase. More voiding may be seen in case of ceramic capacitors used with tin-lead. It is

Complexity Index of PCB for characterising reflow profiles

Electronics Forum | Mon Aug 11 17:42:52 EDT 2003 | Kris

How can one go about defining the complexity of a PCB for characterizing reflow profiles A large balanced board may be easier to profile than smaller unbalanced board ? Any ideas how to define an index to calculate the complexity based on size,weig

Manufacturing breakthroughs?

Electronics Forum | Tue Sep 09 00:51:33 EDT 2003 | iman

everyone made good observations in the arena of improvements. being rather pessimistic today, I'd like to say the one core area of little (if none at all) improvement is the over-reliance of human (aid/non-aid) inspection of SMT output soldering de

New web site

Electronics Forum | Fri Sep 26 16:49:17 EDT 2003 | lysik

I just want a forum to track the bad apples. They are out their and people need to know who they are and the consumer should be fully aware of policies before you buy something. Sometimes they are unclear or the sales engineer tells fib. GenRad does

Re-Reflowing PCB's

Electronics Forum | Tue Oct 14 09:13:14 EDT 2003 | davef

To us, time above liquidous plus 20*C is more important than the 60 sec [er what ever] above 183*C [which we think is meaningless] that the fine solder paste supplier suggest. Based on what you've told us and lacking any failure analysis, we'd gue

MPM3000 vs 3050

Electronics Forum | Sat Dec 06 23:54:49 EST 2003 | Dean

3000 base model 3010 adds feature 3020 adds features 3030 adds features 3040 adds features 3050...top of the line Sorry I don't have the feature list. It's things like Environmental control unit, under stencil wiper, stencil exchanger, 2d inspe


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