Electronics Forum: bcc (Page 1 of 3)

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Fri Aug 09 11:59:31 EDT 2002 | bcceng

Tom, I developed a process for applying solder bumps on BCC32 and BCC48 successfully on my previous employer. The quantities were in the thousands a week, the following process is what I was using: Insert BCC's on process carrier (carrier holds 500

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Mon Mar 25 07:46:28 EST 2002 | Yannick

It maybe a stupid question but what is a BCC package??

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Mon Mar 25 13:48:52 EST 2002 | bcceng

We are currently applying solder bumps to hundreds of BCC's for rework. It is impossible to print to the PWB. It is recommended to apply solder bumps to the BCC's with 63/37 alloy making the rework faster and easier. Applying the solder bump on the

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Sun Mar 24 23:11:36 EST 2002 | sy_koh

I am looking technology for BCC package. The preliminary datasheet from customer show that it had rectangular flat pad on the joint. The smallest pitch is 0.6mm having 96 I/Os. I am currently putting BGA, uBGA, CSP and CBGA onto PCBs usinf no-clean

Micro Leadless Frame - solder wetting control

Electronics Forum | Thu May 09 18:06:42 EDT 2002 | bcceng

janchan, don't know how many LGA's/LCC/BCC's you are placing but a short term solution that I can recommend is the application of solder bumps to the component and than place it after board has gone through reflow or even at the same time. Our compa

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Thu Apr 04 05:33:19 EST 2002 | ianchan

Hi, hope this helps : 1) BCC (bump chip carrier) production for us, was with a 5mils Stencil. The outer perimeter smallish pads are not much of a problems. For the central large pad, we split the paste print (corresponds to the Stencil apperture op

BCC Technology --- Placement, Rework, Reflow

Electronics Forum | Mon Mar 25 08:45:24 EST 2002 | davef

Not dumb at all. It's a 16 pin, 0.65mm plastic SMT package with pads along the package edges proprietary to Fujitsu. Look here: http://www.fme.fujitsu.com/products/pll/pdf/bccover.pdf

QFN Packages

Electronics Forum | Fri Feb 25 12:04:21 EST 2005 | davef

Land grid devices [ie, BCC�, LGA, QFN, MicroLeadFrame�, etc] are essentially BGA devices with the balls removed and with no solder on the pads. Search the fine SMTnet Archives for background discussion.

Amkor Fusion Quad

Electronics Forum | Fri Dec 21 03:21:28 EST 2007 | khushal

Wouldn't it be easier to use a dual row QFN? Have you looked at tsCSP? I think that would be a good options also since it has multiple rows. I am also curious if the tsCSP is just the BCC reborn - any thoughts?

Philips Topaz X vs. Samsung CP45FV

Electronics Forum | Mon May 13 19:47:37 EDT 2002 | bcceng

Mladen, I am in contract manufacturing using the regular Philips Topaz. I started with one now I have four, if market ramps up will be getting more. The Topaz regular can place 0201,BCC,BGA's,Micro BGA's and others depending on the configuration of

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