Electronics Forum | Wed Jan 07 22:43:25 EST 1998 | Myles McIntyre
A potential purchaser of our products (switchmode power supplies for telecommunications) has asked what the benefits of SMT are to him. Our marketing people wish to obtain a list of the benefits of SMT to the purchaser of the end product. i.e. they a
Electronics Forum | Tue Jan 13 13:17:00 EST 1998 | Matt Brown
| We use no clean paste and sometimes experience | flux splattering which gives spot on gold fingers. | Need help in analize the cause. thx. Most often, the 'splattering' is caused by an excessive temperature in the oven: this can cause the solder p
Electronics Forum | Mon Aug 06 10:41:42 EDT 2001 | Stefan Witte
In order to program your board, you are not exposed to the operating system. If you want to "talk" to a Windows machine via LAN, you will have to install a communication software either on the Windows machine ( disc access ) or on the Linux machine
Electronics Forum | Thu Aug 09 15:25:52 EDT 2001 | neil
Your right Dave. The system is set up correctly but sometimes there is a problem deleting messages with attachments. This problem was exacerbated by the scam32 virus. We set up Norton AntiVirus to quarantine these attachments and when you try to dele
Electronics Forum | Fri Aug 10 15:30:38 EDT 2001 | davef
More and more pople are seeing voids in solder connections other than BGA balls than ever before. Thats because they never looked [never had the means to look] before. Now, they can't stand it and, like that zit that their mother told them not to m
Electronics Forum | Thu Aug 30 21:57:26 EDT 2001 | Franky
I have problem about glue printing measurement ,anybody has process of glue printing . How do you measure? as I know "push test" is the method for testing the strength of connection of component and board but I don't have specification of testing for
Electronics Forum | Mon Sep 17 05:18:48 EDT 2001 | V.RAMANAND KINI
Hello! PRO-E is a mechanical design software. It itself has a export to *.bmp (bit map image) facility. It also has many export facilities. Once you have exported it to bmp then you can use the insert command in the word document to insert that bmp
Electronics Forum | Tue Sep 18 18:36:59 EDT 2001 | mparker
... and don't forget proper stencil alignment. Invariably I find most bridging problems for fine pitch parts, etc. is caused by lousy alignment. The alignment must be verified under magnification, using the naked eye is not good enough. Use at least
Electronics Forum | Wed Sep 19 16:02:14 EDT 2001 | fcouture
Pad Metallurgy Used: >Is your question about this targeting the current industry capability of using tin plating technology on such small >pad dimensions? Actually I should have asked for tin/lead plating (HASL) and yes it's to have an idea on capab
Electronics Forum | Mon Sep 24 11:12:56 EDT 2001 | nwyatt
Hi. We are currently using an unconventional method to rework a micro BGA - removing component with hot air, fluxing the area, placing the part with pick and place, then reflowing it in the oven. The reason we are doing it this way and not with a r