Electronics Forum | Tue Jul 29 09:47:40 EDT 2003 | davef
We agree with Russ and Ioan that rework does not cause black pad. It's caused during the board fabrication process. On the other hand, we think: * Mantis wants to reduce the amount of reworking of boards that fail due to a black pad problem. *
Electronics Forum | Tue Jul 29 21:06:14 EDT 2003 | Dean
It is important to measure each brand by class. Example: Measuring a top of the line BTU vs. an entry level Heller would not be fair or solve your problem. Each maker has models to satisfy all market segments. I have both brands in my factory. I
Electronics Forum | Thu Sep 25 18:22:16 EDT 2003 | adlsmt
Just one comment about used equipment. A reason Mr. Bliss gave as contributing to Speedlines woe's. Its a fact of life. Would you buy a car you cant sell in a few years??? Why buy new? Because its faster, better, etc. if its not you won't buy new. My
Electronics Forum | Mon Aug 04 11:19:10 EDT 2003 | Sat
Thanks for the useful feedback. I understand that there is a new Samsung distributor - Dynatech (seems to be very customer oriented - I guess partly because they are a privately held company!) and that they have taken over the existing facility of Sa
Electronics Forum | Sat Aug 09 12:37:40 EDT 2003 | cyber_wolf
Hello all, I am just curious as to the recovery # people are using on their Fuji chipshooters. One of my co-workers insist that we should run on E-stop. I tell him that we should run on 2 or 3 times and operators should be expected to watch the dump
Electronics Forum | Wed Aug 13 21:03:01 EDT 2003 | davef
Your dust collection / humidity / ionic path concern is reasonable. Consider applying your conformal material thick enough to form a good barrier between the device edge and the board, similar to what you do for QFP. [Admittedly the QFP is not a pre
Electronics Forum | Wed Aug 20 21:30:56 EDT 2003 | paulm
Our company if currently reviewing our BGA Screen Printing Process. The problem we are trying to eliminate has to do with BGA Ball Size Variance. Some of our vendors are allowing a +/- of 0.004" in ball size. This would allow for the possibility of a
Electronics Forum | Thu Aug 21 15:10:59 EDT 2003 | paulm
Such balls (=/- 0.004)size variance can occur in a single part. If I have a ball in a part that could be (according to vendor specs) 0.008 larger than another ball the only way I can insure that the smaller ball makes contact with the paste is to hav
Electronics Forum | Thu Aug 21 17:17:47 EDT 2003 | justin
Do some push / pull testing. Typically with black pad, you can flick the components right off the board. If you have this, the boards are about as reliable as a Yugo. If you get decent push / pull results, odds are you don't have black pad and you
Electronics Forum | Fri Aug 22 11:34:32 EDT 2003 | Stephen
Don't forget moisture senitive devices. If you have them on the bottom side, usually you do the other side before it is an issue, but if you are going to store the boards for a while it could be an issue. Where I am, partially building product then
