Electronics Forum: because (Page 226 of 443)

Re: White Residue

Electronics Forum | Mon Dec 06 04:40:39 EST 1999 | cklau

Halo; In your last message you did not mentioned why your customer need to use IPA to clean PCB's as their requirement and what subtances they want to get rid of (is it flux stain PCB's or component?).If so recommend your value customer of flux 910

Re: What Happened??

Electronics Forum | Sat Dec 04 11:33:58 EST 1999 | Clifford Peaslee

Larry, We will be adding the view all messages in a thread on a single page feature shortly. It is in development. Also, it will be different than before. The previous forum version held the parent messages within its message. Now we will show each

Re: ORBOTECH vs. VISCOM

Electronics Forum | Wed Nov 17 15:05:29 EST 1999 | Wade

I have had an Orbotech VT-8000 running in-line for almost a year and have been very pleased. The VT-8000 does everything the application engineers say it can do. The support and honesty provided by the Orbotech staff is outstanding. I talked to Vi

Re: Bare PWB bake out during circuit assembly

Electronics Forum | Fri Nov 05 21:22:34 EST 1999 | chartrain

Amazing in today's technology that people still bake because "that's the way we've alawys done it". Baking is a band aid for poor manufacturing of the PCB. Moisture can become trapped between the layers during buildup. This moisture when it contacts

Polarity of parts in packages

Electronics Forum | Thu Oct 28 20:31:52 EDT 1999 | JC Leigh

Hi all, Been thinking about this problem because it's costed us some errors before. For the same type of parts from different vendors, the polarity of parts in the taping may differ from vendor to vendor. (Actually, we find that parts from most ve

Re: Research of information on SMT technology...

Electronics Forum | Thu Oct 28 09:41:05 EDT 1999 | Dave F

Michael: Surface mounting technology is a broad topic. People make careers focusing on very narrow elements of the technology. I'm certain that writing an overview of SMT would not win you many points from your instructor, because that element of

Re: moisture in pcb's how is it measured

Electronics Forum | Wed Oct 20 10:49:04 EDT 1999 | Brian

Hi! Stu's method is a half-truth. What it measures is the aggregate of all volatile material with a significant vapour pressure at the baking temperature, not just H2O. Short of very complex methods, it could be complemented by a comparitive measur

Re: solder mask wrinkles

Electronics Forum | Tue Oct 19 16:59:58 EDT 1999 | Carol Zhang

Hi, thank you for the idea. I may try solder iron, but it much more slower since I have to solder spacers one by one. a stimpson press is used to press the spacer on the board and the edges of the spacers are rolled. Then we solder the edges to

Re: bottom side epoxy

Electronics Forum | Thu Oct 07 03:08:57 EDT 1999 | Chris May

| I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placement

Re: bottom side epoxy

Electronics Forum | Thu Oct 07 05:53:54 EDT 1999 | Wolfgang Busko

| | I recently had the opportunity to visit the vendor who is making my boards. On my trip I noticed that the guy who was in charge of the SMD placement machine (brand new Samsung) still had to manuallly place about 20%-40% of the parts after placeme


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