Electronics Forum | Wed Jan 27 21:14:39 EST 1999 | Dave F
| Some of you can please tell where do I can find information about standards used for SMT devices? | | Thanks | Enrique: Scott is correct that the IPC is an out-standing source of standards information. Other respected standard setting groups ar
Electronics Forum | Fri Dec 06 10:16:57 EST 2002 | davef
Bare board cleanliness is still primarily measured by resistivity of solvent extract (ROSE) using instruments such as Omegameters and Zero Ions. What is considered as "acceptable" cleanliness varies between specification and from company to company.
Electronics Forum | Thu Oct 07 20:34:48 EDT 1999 | Tony Huang
Hi, Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! Thanks, Tony
Electronics Forum | Fri Oct 08 18:26:19 EDT 1999 | Dave F
| | Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | | | PCB is FR4 | | Solder Mask is LPI | | Reflow and W/S Profile = Standard | | | | t
Electronics Forum | Fri Oct 08 13:04:15 EDT 1999 | Dave F
| Is there an IPC Standard stating the max. number of times that a PCB can pass through a reflow or wavesolder machine without having solder mask breakdown. | | PCB is FR4 | Solder Mask is LPI | Reflow and W/S Profile = Standard | | thanks and rega
Electronics Forum | Fri Oct 08 17:12:31 EDT 1999 | Dave F
| Hi, | | Does anybody know what is the minimum gold plating thickness on the PCB goldfinger required by the industrial specifications - IPC, Bellcore, etc. Where can I find the information? Appreciate for the help! | | Thanks, | Tony | Hi Tony:
Electronics Forum | Fri Nov 12 10:36:33 EST 1999 | Dave F
Wolfgang: Sure, stacking chip components is common practice in prototyping, as you say, but it's not good practice for production work. Documentation: * ANSI-IPC-275 does not allow stacking * MIL-STD-2000A does not allow stacking * J-STD-001B is u
Electronics Forum | Fri Oct 08 21:21:21 EDT 1999 | John
Although I can specify it, is ther a way I can test in test (in house)to be sure it's as specified? I don't need it now. I'm thinking of when I will need it. Thanks, John | | Hi, | | | | Does anybody know what is the minimum gold plating thickn
Electronics Forum | Fri Feb 13 18:50:27 EST 1998 | C. Lao
I'm in the process of running a no-clean paste evaluation. I'm presently writing the specifications for the laboratory test requirements (SIR testing, flux testing, etc.). So far, I've developed a very comprehensive set of test criteria using muc
Electronics Forum | Thu Nov 10 21:15:39 EST 2005 | davef
Years ago, there was discussion of making a "IPC-A-640" to define requirements for assemblies comprised of more than a circuit board assembly. We don't know what happened after that. As an alternative consider: Telcordia GR-78 - Generic Requiremen
