Electronics Forum | Tue Nov 03 10:33:10 EST 1998 | Chrys
| We run stiffeners on all of our product through our wave solder process and most of our product through our reflow and adhesive cure oven. The problem is we continually put on and take off stiffeners because of poor reliability of stiffeners stayi
Electronics Forum | Tue Nov 03 12:23:00 EST 1998 | Bill Schreiber
Kelly, How are you cleaning the stiffeners? The Smart Sonic cleaning process has been very successful in such applications. Visit the Smart Sonic Web Site at: www.smartsonic.com Or call me at 1(800) 806-440-R. Regards, Bill | We run stiffeners
Electronics Forum | Wed Nov 04 16:56:27 EST 1998 | Chris Lampron
| | We run stiffeners on all of our product through our wave solder process and most of our product through our reflow and adhesive cure oven. The problem is we continually put on and take off stiffeners because of poor reliability of stiffeners sta
Electronics Forum | Thu Oct 15 17:29:29 EDT 1998 | Christopher L.
| We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are current
Electronics Forum | Thu Oct 15 21:19:21 EDT 1998 | Scott McKee
| We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are current
Electronics Forum | Thu Sep 03 18:48:52 EDT 1998 | Pete Sorenson
| I am in need of possible causes and solutions to capacitors that are failing in the field. | Are there issues in our process that need to be | checked? | Some people said the problems are due to improper | storage. Others say it is thermal stre
Electronics Forum | Thu Aug 06 22:01:29 EDT 1998 | Dave F
| No sour grapes, | This has gone on too long. I expect no free advertising, nor do I seek it. It is clearly understood Bob is an industry leading consultant. What is not understood, at least by me, how he is allowed to "advertise" so freely on this
Electronics Forum | Thu Jul 23 07:33:28 EDT 1998 | The Wretched SMD
200 boards/Hr and oven will reflow ~180 boards/Hr but the P&P machine will only place 700-950 CPH when setup is taken into account. Minimum pitch is normally .020" and we place an Avg. of 491 TSSOPs and 217 BGAs a month. We don't even bother with 04
Electronics Forum | Tue Jun 02 12:58:07 EDT 1998 | Michael Allen
"...the part is aligned to the pads with in 10% before going into the IR oven." Sounds like the pad pitch might be okay (?). If that's not the problem, then what? I wish I had the answer, because I've struggled with heavy QFPs for some time now (2
Electronics Forum | Tue May 26 07:46:26 EDT 1998 | Peter H. Cote
We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg. C
